AD7921ARM-REEL7 Analog Devices Inc, AD7921ARM-REEL7 Datasheet - Page 24

• Manufacturer Part Number: AD7921ARM-REEL7
• Description: IC ADC 12BIT DUAL LP 8-MSOP
• Manufacturer: Analog Devices Inc

Specifications of AD7921ARM-REEL7

• Number Of Bits: 12
• Sampling Rate (per Second): 250k
• Data Interface: DSP, MICROWIRE™, QSPI™, Serial, SPI™
• Number Of Converters: 1
• Power Dissipation (max): 20mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: AD7921ARM-REEL7TR

AD7911/AD7921
APPLICATION HINTS
GROUNDING AND LAYOUT
The printed circuit board that houses the AD7911/AD7921
should be designed such that the analog and digital sections are
separated and confined to certain areas of the board. This
facilitates the use of ground planes that can be separated easily.
A minimum etch technique is generally best for ground planes,
because it gives the best shielding. Digital and analog ground
planes should be joined at only one place. If the AD7911/
AD7921 is in a system where multiple devices require an
AGND-to-DGND connection, the connection should still be
made at one point only, a star ground point that should be
established as close as possible to the AD7911/AD7921.
Avoid running digital lines under the device, because these
couple noise onto the die. The analog ground plane should be
allowed to run under the AD7911/AD7921 to avoid noise
coupling. The power supply lines to the AD7911/AD7921
should use as large a trace as possible to provide low impedance
paths and reduce the effects of glitches on the power supply line.
Fast-switching signals like clocks should be shielded with digital
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ground to avoid radiating noise to other sections of the board,
and clock signals should never be run near the analog inputs.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other to
reduce the effects of feedthrough through the board. A micro-
strip technique is by far the best, but is not always possible with
a double-sided board. In this technique, the component side of
the board is dedicated to ground planes, while signals are placed
on the solder side.
Good decoupling is also very important. The analog supply
should be decoupled with 10 µF tantalum in parallel with 0.1 µF
capacitors to AGND. To achieve the best performance from
these decoupling components, the user should endeavor to keep
the distance between the decoupling capacitor and the V
GND pins to a minimum with short track lengths connecting
the respective pins.
DD
and