MCP3304-CI/SL Microchip Technology, MCP3304-CI/SL Datasheet - Page 16

• Manufacturer Part Number: MCP3304-CI/SL
• Description: IC ADC 13BIT 2.7V 4CH SPI 16SOIC
• Manufacturer: Microchip Technology

Specifications of MCP3304-CI/SL

• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Number Of Bits: 13
• Sampling Rate (per Second): 100k
• Data Interface: Serial, SPI™
• Number Of Converters: 1
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Architecture: SAR
• Conversion Rate: 100 KSPs
• Resolution: 12 bit
• Input Type: Voltage
• Snr: 80.02 dB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: MCP3304CI/SL

MCP3302/04
3.7
Ground connection to internal analog circuitry. To
ensure accuracy, this pin must be connected to the
same ground as DGND. If an analog ground plane is
available, it is recommended that this device be tied to
the analog ground plane in the circuit. See Section 5.6
“Layout Considerations” for more information
regarding circuit layout.
3.8
This input pin provides the reference voltage for the
device, which determines the maximum range of the
analog input signal and the LSB size.
The LSB size is determined according to the equation
shown below. As the reference input is reduced, the
LSB size is reduced accordingly.
EQUATION 3-1:
When using an external voltage reference device, the
system
manufacturer’s recommendations for circuit layout.
Any instability in the operation of the reference device
will have a direct effect on the accuracy of the ADC
conversion results.
DS21697E-page 16
Analog Ground (AGND)
Voltage Reference (V
designer
LSB Size =
should
2 x V
always
8192
REF
REF
refer
)
to
the
3.9
The voltage on this pin can range from 2.7 to 5.5V. To
ensure accuracy, a 0.1 µF ceramic bypass capacitor
should be placed as close as possible to the pin. See
Section 5.6 “Layout Considerations” for more
information regarding circuit layout.
Power Supply (V
© 2008 Microchip Technology Inc.
DD
)