DS1746-70 Maxim Integrated Products, DS1746-70 Datasheet - Page 15

• Manufacturer Part Number: DS1746-70
• Description: IC RTC RAM Y2K 5V 70NS 32-EDIP
• Manufacturer: Maxim Integrated Products
• Type: Clock/Calendar/NVSRAM/Y2Kr

Specifications of DS1746-70

• Memory Size: 1M (128K x 8)
• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 32-DIP Module (600 mil), 32-EDIP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

AC TEST CONDITIONS
Output Load: 50pF + 1TTL Gate
Input Pulse Levels: 0 to 3.0V
Timing Measurement Reference Levels:
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) Voltages are referenced to ground.
2) Typical values are at +25C and nominal supplies.
3) Outputs are open.
4) Battery switchover occurs at the lower of either the battery terminal voltage or V
5) Data-retention time is at +25C.
6) Each DS1746 has a built-in switch that disconnects the lithium source until V
7) RTC modules (DIP) can be successfully processed through conventional wave-soldering techniques
8) t
9) t
10) t
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
user. The expected t
time in the absence of V
as long as temperatures as long as temperature exposure to the lithium energy source contained within
does not exceed +85C. Post-solder cleaning with water-washing techniques is acceptable, provided
that ultra-sonic vibration is not used.
In addition, for the PowerCap:
a) Maxim recommends that PowerCap module bases experience one pass through solder reflow
b) Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
WR1
WR2
WC
oriented with the label side up (“live-bug”).
3 seconds. To solder, apply flux to the pad, heat the lead frame pad, and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows, and use a solder wick to
remove solder.
34 PWRCP
Input: 1.5V
Output: 1.5V
= 200ns.
, t
, t
32 EDIP
DH1
DH2
are measured from WE going high.
are measured from CE going high.
DR
is defined for DIP modules and assembled PowerCap modules as a cumulative
CC
PACKAGE CODE
starting from the time power is first applied by the user.
MDF32+1
PC2+6
DS1746/DS1746P Y2K-Compliant, Nonvolatile Timekeeping RAMs
15 of 16
DOCUMENT NO.
21-0245
21-0246
LAND PATTERN NO.
CC
Note that a “+”, “#”, or “-”
PF
is first applied by the
.
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