ISL12027IB27AZ Intersil, ISL12027IB27AZ Datasheet - Page 28
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ISL12027IB27AZ
Manufacturer Part Number
ISL12027IB27AZ
Description
IC RTC/CALENDAR EEPROM 8-SOIC
Manufacturer
Intersil
Type
Clock/Calendar/Supervisor/EEPROMr
Specifications of ISL12027IB27AZ
Memory Size
4K (512 x 8)
Time Format
HH:MM:SS (12/24 hr)
Date Format
YY-MM-DD-dd
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Clock Format
HH
Clock Ic Type
RTC
Interface Type
I2C, Serial
Memory Configuration
512 X 8
Supply Voltage Range
2.7V To 5.5V
Digital Ic Case Style
SOIC
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ISL12027IB27AZ
Manufacturer:
Intersil
Quantity:
669
Part Number:
ISL12027IB27AZ
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Company:
Part Number:
ISL12027IB27AZ-T
Manufacturer:
SST
Quantity:
1 200
Thin Shrink Small Outline Plastic Packages (TSSOP)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
0.10(0.004)
JEDEC MO-153-AC, Issue E.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
feature must be located within the crosshatched area.
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
are not necessarily exact. (Angles in degrees)
2
-A-
INDEX
AREA
3
e
0.05(0.002)
b
D
M
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
C A
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
SEATING PLANE
M
E1
For information regarding Intersil Corporation and its products, see www.intersil.com
-C-
-B-
B S
A
28
E
A1
α
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
0.010
A2
M
0.25
B
M
L
c
ISL12027
M8.173
8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE
PLASTIC PACKAGE
SYMBOL
A1
A2
E1
A
D
E
N
α
b
c
e
L
0.002
0.031
0.0075
0.0035
0.116
0.169
0.246
0.0177
MIN
0
-
0.026 BSC
o
INCHES
8
0.047
0.006
0.051
0.0118
0.0079
0.120
0.177
0.256
0.0295
MAX
8
o
MILLIMETERS
0.05
0.80
0.19
0.09
2.95
4.30
6.25
0.45
MIN
0
-
o
0.65 BSC
8
MAX
1.20
0.15
1.05
0.30
0.20
3.05
4.50
6.50
0.75
8
o
October 18, 2006
Rev. 1 12/00
NOTES
FN8232.4
9
3
4
6
7
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