NBSG11BA ON Semiconductor, NBSG11BA Datasheet - Page 9

IC DRIVER CLK RSECL 1:2 16FCBGA

NBSG11BA

Manufacturer Part Number
NBSG11BA
Description
IC DRIVER CLK RSECL 1:2 16FCBGA
Manufacturer
ON Semiconductor
Type
Fanout Buffer (Distribution)r
Datasheet

Specifications of NBSG11BA

Number Of Circuits
1
Ratio - Input:output
1:2
Differential - Input:output
Yes/Yes
Input
CML, LVCMOS, LVDS, LVTTL, NECL, RSNECL, PECL
Output
RSECL, RSPECL, RSNECL
Frequency - Max
12GHz
Voltage - Supply
2.375 V ~ 3.465 V
Operating Temperature
-40°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
16-FCBGA
Frequency-max
12GHz
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
NBSG11BAOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NBSG11BA
Manufacturer:
ON Semiconductor
Quantity:
10 000
Part Number:
NBSG11BAHTBG
Manufacturer:
ON Semiconductor
Quantity:
10 000
Part Number:
NBSG11BAR2
Manufacturer:
ON Semiconductor
Quantity:
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NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
27. Measured using a 500 mV source, 50% duty cycle clock source. All loading with 50 W to V
28. See Figure 5. t
29. Within-Device skew is defined as identical transitions on similar paths through a device.
30. Device-to-device skew for identical transitions at identical V
31. V
Table 9. AC CHARACTERISTICS for QFN-16
f
t
t
t
t
V
t
t
Symbol
max
PLH
PHL
SKEW
JITTER
r
f
INPP
output amplitude is approximately 200 mV (as shown in Figure 4, where output P-P spec is shown as a minimum/guarantee of around
150 mV). Input edge rates 40 ps (20% - 80%).
INPP
,
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
(MAX) cannot exceed V
Maximum Frequency
(See Figure 4. F
Propagation Delay to
Output Differential
Duty Cycle Skew (Note 28)
Within-Device Skew (Note 29)
Device-to-Device Skew (Note 30)
RMS Random Clock Jitter
Peak-to-Peak Data Dependent Jitter
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 31)
Output Rise/Fall Times
(20% - 80%) @ 1 GHz
SKEW
= |t
Characteristic
PLH
600
500
400
300
200
100
max
Ñ Ñ
Ñ Ñ Ñ Ñ
Ñ Ñ Ñ Ñ
Ñ Ñ
Ñ Ñ
Ñ Ñ
0
- t
Figure 4. Output Voltage Amplitude (V
/JITTER) (Note 27)
CC
PHL
Ó Ó Ó
Ñ Ñ Ñ Ñ Ñ Ñ
Ó Ó Ó
Ñ Ñ Ñ Ñ Ñ Ñ
Ó Ó Ó
Ó Ó Ó
Ó Ó Ó
Ó Ó Ó
Ó Ó Ó
Ó Ó Ó
1
Input Frequency (f
- V
| for a nominal 50% Differential Clock Input Waveform.
OUTPUT P-P SPEC
EE
2
.
f
f
in
Ô Ô
Ô Ô Ô Ô
Ô Ô Ô Ô
Ô Ô
Ô Ô
Ô Ô
in
< 10 Gb/s
< 10 GHz
3
Ö Ö Ö
Ö Ö Ö
Ö Ö Ö
Ö Ö Ö
Ö Ö Ö
Ö Ö Ö
Ö Ö Ö
Ö Ö Ö
Q, Q
4
V
INPUT FREQUENCY (GHz)
CC
Ñ Ñ
Ñ Ñ Ñ Ñ
Ñ Ñ Ñ Ñ
Ñ Ñ
Ñ Ñ Ñ Ñ Ñ
Ñ Ñ
Ñ Ñ
http://onsemi.com
in
10.5
Min
= 0 V; V
5
RMS JITTER
90
75
15
) at Ambient Temperature (Typical)
Ó Ó Ó Ó
Ó Ó
Ó Ó
Ó Ó Ó Ó
Ó Ó
OUTPUT AMP.
CC
NBSG11
Ô Ô Ô
Ô Ô Ô
Ô Ô Ô
Ô Ô Ô
Ô Ô Ô
Ô Ô Ô
6
-40°C
levels.
EE
TBD
Typ
125
0.2
12
25
30
9
3
6
= -3.465 V to -2.375 V or V
7
Ò Ò
Ò Ò Ò Ò
Ò Ò
Ò Ò
2600
Max
160
15
15
50
55
1
8
Õ Õ Õ Õ
Õ Õ Õ Õ
OUTPP
Š Š Š
Š Š Š
Š Š Š
Š Š Š
9
10.5
Min
90
75
20
) / RMS Jitter vs.
10
25°C
Ú Ú
Ú Ú Ú Ú Ò Ò Ò
CC
TBD
Typ
125
0.2
12
25
30
3
6
-2.0 V. For minimum f
11
Ò Ò Ò
CC
2600
Max
160
15
15
50
55
12
1
= 2.375 V to 3.465 V; V
9.5
8.5
7.5
6.5
5.5
4.5
3.5
2.5
1.5
0.5
-0.5
10.5
Min
90
75
20
85°C
max
TBD
Typ
125
0.2
12
25
30
3
6
value of 10.5 GHz,
2600
Max
160
15
15
50
55
EE
1
= 0 V
Unit
GHz
mV
ps
ps
ps
ps

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