NBSG11BA ON Semiconductor, NBSG11BA Datasheet - Page 11

• Manufacturer Part Number: NBSG11BA
• Description: IC DRIVER CLK RSECL 1:2 16FCBGA
• Manufacturer: ON Semiconductor
• Type: Fanout Buffer (Distribution)r

Specifications of NBSG11BA

• Number Of Circuits: 1
• Ratio - Input:output: 1:2
• Differential - Input:output: Yes/Yes
• Input: CML, LVCMOS, LVDS, LVTTL, NECL, RSNECL, PECL
• Output: RSECL, RSPECL, RSNECL
• Frequency - Max: 12GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-FCBGA
• Frequency-max: 12GHz
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: NBSG11BAOS

LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
-Y-
3 X
E
A
e
0.20
S
A2
-X-
ROTATED 90 CLOCKWISE
A1
VIEW M-M
4
DETAIL K
3
D
_
4
2
PLASTIC 4X4 (mm) BGA FLIP CHIP PACKAGE
1
A
B
C
D
0.10 Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
16 X
16 X
PACKAGE DIMENSIONS
3
5
0.15 Z
b
http://onsemi.com
0.15
0.08
-Z-
CASE 489-01
BA SUFFIX
FCBGA-16
M
M
ISSUE O
K
NBSG11
Z
Z
11
X
M
M
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
PER ASME Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A1
A2
A
b
D
E
e
S
MILLIMETERS
MIN
0.25
0.30
1.40 MAX
1.20 REF
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
MAX
0.35
0.50