MPC9443AE Freescale Semiconductor, MPC9443AE Datasheet - Page 9

• Manufacturer Part Number: MPC9443AE
• Description: IC CLOCK FANOUT BUFF LV 48-LQFP
• Manufacturer: Freescale Semiconductor
• Type: Fanout Buffer (Distribution), Divider, Multiplexerr

Specifications of MPC9443AE

• Number Of Circuits: 1
• Ratio - Input:output: 2:16
• Differential - Input:output: Yes/No
• Input: LVCMOS, LVPECL
• Output: LVCMOS
• Frequency - Max: 350MHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Frequency-max: 350MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Power Consumption of the MPC9443
and Thermal Management
operating frequency range up to 350 MHz. The MPC9443
power consumption and the associated long-term reliability
may decrease the maximum frequency limit, depending on
operating conditions such as clock frequency, supply voltage,
output loading, ambient temperature, vertical convection and
thermal conductivity of package and board. This section
describes the impact of these parameters on the junction
temperature and gives a guideline to estimate the MPC9443 die
junction temperature and the associated device reliability. For a
complete analysis of power consumption as a function of
operating conditions and associated long term device reliability
please refer to the application note AN1545. According the
AN1545, the long-term device reliability is a function of the die
junction temperature:
Table 13. Die Junction Temperature and MTFBF
temperature and impact the device reliability (MTBF).
According to the system-defined tolerable MTBF, the die
junction temperature of the MPC9443 needs to be controlled
and the thermal impedance of the board/package should be
optimized. The power dissipated in the MPC9443 is
represented in equation 1.
MPC9443, C
(Μ)Σ
number of active outputs (N is always 16 in case of the
MPC9443). The MPC9443 supports driving transmission lines
to maintain high signal integrity and tight timing parameters.
Any transmission line will hide the lumped capacitive load at the
end of the board trace, therefore,
transmission line systems and can be eliminated from
equation 1. Using parallel termination output termination results
in equation 2 for power dissipation.
TIMING SOLUTIONS
P
P
T
f
CLOCK,MAX
J
TOT
TOT
The MPC9443 AC specification is guaranteed for the entire
Increased power consumption will increase the die junction
Where I
= T
Junction Temperature (°C)
C
=
= V
L
A
represents the external capacitive output load, N is the
[
+ P
I
CC
CCQ
CCQ
TOT
PD
=
·
[
C
is the static current consumption of the
+ V
100
110
120
130
is the power dissipation capacitance per output,
I
· R
CCQ
PD
CC
thja
· N · V
+ V
1
· f
CLOCK
CC
2
CC
· f
CLOCK
·
·
(
[
N · C
Σ
C
T
·
L
j,MAX
(
is zero for controlled
PD
R
N · C
thja
+
MTBF (Years)
M
– T
Σ
PD
C
20.4
9.1
4.2
2.0
A
L
+
M
)
Σ
]
– (I
· V
C
L
CCQ
CC
)
]
+
· V
P
Σ
CC
[
9
DC
)
]
Q
parallel or thevenin termination, V
function of the output termination technique and DC
clock signal duty cycle. If transmission lines are used
zero in equation 2 and can be eliminated. In general, the use of
controlled transmission line techniques eliminates the impact of
the lumped capacitive loads at the end lines and greatly
reduces the power dissipation of the device. Equation 3
describes the die junction temperature T
power consumption.
(junction to ambient) and T
According to Table 13, the junction temperature can be used to
estimate the long-term device reliability. Further, combining
equation 1 and equation 2 results in a maximum operating
frequency for the MPC9443 in a series terminated transmission
line system.
requirements and Table 13. R
The R
boards will result in a lower thermal impedance than indicated
below.
Table 14. Thermal Package Impedance of the 48 ld LQFP
becomes the upper clock speed limit for the given application
conditions. The following eight derating charts describe the safe
frequency operation range for the MPC9443. The charts were
calculated for a maximum tolerable die junction temperature of
110°C (120°C), corresponding to an estimated MTBF of 9.1
years (4 years), a supply voltage of 3.3 V and series terminated
transmission line or capacitive loading. Depending on a given
set of these operating conditions and the available device
convection a decision on the maximum operating frequency
can be made.
· I
OH
In equation 2, P stands for the number of outputs with a
Where R
T
If the calculated maximum frequency is below 250 MHz, it
J,MAX
Convection,
· (V
thja
100 lfpm
200 lfpm
300 lfpm
400 lfpm
500 lfpm
Still air
LFPM
CC
represent data based on 1S2P boards, using 2S2P
should be selected according to the MTBF system
thja
– V
is the thermal impedance of the package
OH
) + (1 – DC
R
thja
A
(1P2S board),
is the ambient temperature.
K/W
thja
Q
69
64
) · I
can be derived from Table 14.
OL
OL
, I
· V
OL
OL
, V
J
as a function of the
]
OH
R
thja
and I
(2P2S board),
MPC9443
K/W
MOTOROLA
Equation 1
Equation 2
Equation 3
Equation 4
53
50
OH
Q
Σ
is the
are a
C
L
is