SY89828LHI Micrel Inc, SY89828LHI Datasheet - Page 13

• Manufacturer Part Number: SY89828LHI
• Description: IC BUFFER DUAL 1:10 IVDS 64-TQFP
• Manufacturer: Micrel Inc
• Series: Precision Edge®r
• Type: Fanout Buffer (Distribution), Multiplexer , Translatorr

Specifications of SY89828LHI

• Number Of Circuits: 2
• Ratio - Input:output: 2:10
• Differential - Input:output: Yes/Yes
• Input: LVDS, PECL
• Output: LVDS
• Frequency - Max: 1GHz
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad, 64-eTQFP, 64-HTQFP, 64-VQFP
• Frequency-max: 1GHz
• Clock Ic Type: Clock Divider / Fan-out Buffer
• Frequency: 1GHz
• No. Of Outputs: 10
• Ic Output Type: LVDS
• Supply Current: 45mA
• Supply Voltage Range: 3V To 3.6V
• Digital Ic Case Style: TQFP
• No. Of Pins: 64
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

MicreL, Inc.
M9999-012208
[e-mail] or [phone]
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
64-PIN EPAD-TQFP (DIE UP) (H64-1)
+0.03
–0.03
+0.012
–0.012
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL
Package Notes:
Note 1.
Note 2.
Note 3.
+ 1 [phone]
PCB Thermal Consideration for 64-Pin EPAD-TQFP Package
+0.05
–0.05
+0.012
–0.012
Heat Dissipation
Package meets Level 3 qualifications.
All parts are 100% baked and dry-packed before shipment.
Exposed pad must be soldered to a ground for proper thermal management.
Micrel for any damages resulting from such use or sale.
+0.05
–0.05
+0.002
–0.002
FAX
© 2002 Micrel, Incorporated.
+ 1 [phone]
13
+0.05
–0.05
+0.002
–0.002
CompSide Island
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
WEB
http://www.micrel.com
Package
EP- Exposed Pad
Die
V
V
EE
EE
+0.15
–0.15
+0.006
–0.006
Rev. 02
Precision Edge
SY89828L
®