SY89823LHI Micrel Inc, SY89823LHI Datasheet - Page 8

• Manufacturer Part Number: SY89823LHI
• Description: IC BUFFER/XLATOR HSTL FAN 64TQFP
• Manufacturer: Micrel Inc
• Type: Fanout Buffer (Distribution), Multiplexer , Translatorr
• Series: Precision Edge®r

Specifications of SY89823LHI

• Number Of Circuits: 1
• Ratio - Input:output: 2:22
• Differential - Input:output: Yes/Yes
• Input: HSTL, LVPECL
• Output: HSTL
• Frequency - Max: 500MHz
• Voltage - Supply: 3.15 V ~ 3.45 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad, 64-eTQFP, 64-HTQFP, 64-VQFP
• Frequency-max: 500MHz
• Number Of Clock Inputs: 2
• Mode Of Operation: Differential
• Output Frequency: 500MHz
• Output Logic Level: HSTL
• Operating Supply Voltage (min): 3.15V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.45V
• Package Type: TQFP EP
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Signal Type: HSTL/LVPECL
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Micrel, Inc.
M9999-091908
[e-mail] or [phone]
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
64-PIN EPAD-TQFP (DIE UP) (H64-1)
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
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Package Notes:
1. Package meets Level 2 qualification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL
+ 1 [phone]
PCB Thermal Consideration for 64-Pin EPAD-TQFP Package
Heat Dissipation
(Always solder or equivalent the exposed pad to the PCB)
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Micrel for any damages resulting from such use or sale.
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FAX
© 2005 Micrel, Incorporated.
+ 1 [phone]
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CompSide Island
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
WEB
http://www.micrel.com
Package
EP- Exposed Pad
Die
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V
EE
EE
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Rev. 02
Precision Edge
SY89823L
®