PCK9447BD,157 NXP Semiconductors, PCK9447BD,157 Datasheet - Page 15

• Manufacturer Part Number: PCK9447BD,157
• Description: IC FANOUT BUFFER 1:9 32LQFP
• Manufacturer: NXP Semiconductors
• Type: Fanout Buffer (Distribution), Multiplexerr

Specifications of PCK9447BD,157

• Number Of Circuits: 1
• Ratio - Input:output: 2:9
• Differential - Input:output: No/No
• Input: LVCMOS
• Output: LVCMOS
• Frequency - Max: 350MHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Frequency-max: 350MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3565; 935280283157; PCK9447BD

Philips Semiconductors
13. Abbreviations
14. Revision history
Table 12:
9397 750 12522
Product data sheet
Document ID
PCK9447_1
Revision history
Release date
20051013
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Table 11:
Acronym
ESD
HBM
MM
LVCMOS
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 C
body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Data sheet status
Product data sheet
Description
ElectroStatic Discharge
Human Body Model
Machine Model
Low Voltage Complementary Metal Oxide Silicon
Rev. 01 — 13 October 2005
10 C measured in the atmosphere of the reflow oven. The package
Change notice
-
3.3 V/2.5 V 1 : 9 LVCMOS clock fan-out buffer
Doc. number
9397 750 12522
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Supersedes
-
PCK9447
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