SY89202UMG Micrel Inc, SY89202UMG Datasheet - Page 7

IC BUFFER/CLK DIVIDER 1:8 32-MLF

SY89202UMG

Manufacturer Part Number
SY89202UMG
Description
IC BUFFER/CLK DIVIDER 1:8 32-MLF
Manufacturer
Micrel Inc
Type
Fanout Buffer (Distribution), Divider, Multiplexerr
Series
Precision Edge®r
Datasheet

Specifications of SY89202UMG

Number Of Circuits
1
Ratio - Input:output
1:8
Differential - Input:output
Yes/Yes
Input
CML, LVDS, PECL
Output
LVPECL
Frequency - Max
1.5GHz
Voltage - Supply
2.375 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-MLF®, QFN
Frequency-max
1.5GHz
Number Of Clock Inputs
1
Mode Of Operation
Differential
Output Logic Level
LVPECL
Operating Supply Voltage (min)
2.375V
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Package Type
MLF
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Signal Type
CML/LVDS/PECL
Mounting
Surface Mount
Pin Count
32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
576-1537-5
SY89202UMG

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SY89202UMG
Manufacturer:
MICREL
Quantity:
330
AC Electrical Characteristics
V
Notes:
6.
7.
8.
9.
10. Deterministic jitter is measured with a K28.7 101010 pattern, measured at <f
11. Random jitter is measured with a K28.7 101010 pattern, measured at <f
12. Total jitter definition: with an ideal clock input of frequency <f
13. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, T
Micrel, Inc.
Symbol
f
t
t
Tempco
t
t
t
August 2007
CC
MAX
PD
PD
SKEW
JITTER
r,
t
f
Measured with 100mV input swing. See “Timing Diagrams” section for definition of parameters. High-frequency AC-parameters are guaranteed by
design and characterization.
Within-bank skew is the difference in propagation delays among the outputs within the same bank.
Bank-to-bank skew is the difference in propagation delays between outputs from different banks. Bank-to-bank skew is also the phase offset
between each bank, after MR is applied.
Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the
respective inputs.
specified peak-to-peak jitter value.
signal.
= 2.5V ±5% or 3.3V ±10%; T
Parameter
Maximum Output Toggle Frequency
Maximum Input Frequency
Differential Propagation Delay
/MR – Q Propagation Delay
Differential Propagation Delay
Temperature Coefficient
Within-bank Skew
Bank-to-Bank Skew
Bank-to-Bank Skew
Part-to-Part Skew
Deterministic Jitter (DJ)
Random Jitter (RJ)
Total Jitter
Cycle-to-Cycle Jitter
Output Rise/Fall Time
A
= –40ºC to + 85ºC, R
(6)
Condition
Output swing ≥ 400mV
IN-to-Q
Within same fanout bank, Note 7
Same divide setting, Note 8
Different divide setting, Note 8
Note 9
Note 10
Note 11
Note 12
Note 13
20% to 80%, At full output swing.
MAX
, no more than one output edge in 10
L
= 50Ω to V
MAX
7
.
MAX
.
CC
n
–2V, unless otherwise stated.
– T
n-1
where T is the time between rising edges of the output
hbwhelp@micrel.com
12
Min
530
1.5
3.0
70
output edges will deviate by more than the
Typ
700
115
130
10
15
25
or (408) 955-1690
Max
M9999-083107-C
930
900
200
220
25
35
50
10
10
1
1
SY89202U
ps
ps
Units
fs/
GHz
GHz
ps
ps
ps
ps
ps
ps
ps
ps
ps
RMS
RMS
o
PP
PP
C

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