EL5001IL-T7 Intersil, EL5001IL-T7 Datasheet - Page 6

• Manufacturer Part Number: EL5001IL-T7
• Description: IC CLOCK DRIVER 6-CHAN 20-QFN
• Manufacturer: Intersil
• Type: Buffer/Driverr

Specifications of EL5001IL-T7

• Input: CMOS, TTL
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Voltage - Supply: -
• Frequency-max: -
• Output: -

Typical Performance Curves
FIGURE 15. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 17. PACKAGE POWER DISSIPATION vs AMBIENT
3.5
2.5
1.5
0.5
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
3
2
1
0
0
0
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - HTSSOP EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
JEDEC JESD51-3 AND SEMI G42-88 (SINGLE
LAYER) TEST BOARD
R
C
V
V
667mW
2.857W
TEMPERATURE
TEMPERATURE
S
S
L
L
=0Ω
=500pF
=V-=0V
=V+=18V
25
25
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
FIGURE 13. SKEW
50
50
TIME (10ns/DIV)
6
75
75
85
85
MAXIMUM
SKEW=5.0ns
100
100
(Continued)
125
125
150
150
EL5001
FIGURE 16. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 18. PACKAGE POWER DISSIPATION vs AMBIENT
-100
-150
-200
-250
-300
150
100
-50
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
2.5
1.5
0.5
FIGURE 14. INPUT CURRENT vs VOLTAGE
50
0
1
0
3
2
1
0
-2
0
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
800mW
2.500W
R
C
TEMPERATURE
TEMPERATURE
L
L
-1
=0Ω
=500pF
25
25
0
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
1
50
50
2
V
IN
75
75
3
(V)
85
85
4
100
100
5
6
125
125
January 31, 2005
7
150
150
8
FN7376.2