41C Cinch Connectors, 41C Datasheet - Page 4

PLUG BUTTON .5" HOLE

41C

Manufacturer Part Number
41C
Description
PLUG BUTTON .5" HOLE
Manufacturer
Cinch Connectors
Type
Body Plugr
Datasheets

Specifications of 41C

Color
Natural
Hole Diameter
0.500" (12.70mm)
Flange Diameter
0.656" (16.66mm)
External Diameter
16.67mm
Mounting Hole Dia
12.7mm
Accessory Type
Plug Button
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Panel Thickness
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
41C0R5
Manufacturer:
INFINEON
Quantity:
10 000
Part Number:
41C1000AJ60
Manufacturer:
WURTH
Quantity:
30 000
Part Number:
41C1R5
Manufacturer:
INFINEON
Quantity:
10 000
Part Number:
41CA
Manufacturer:
MICROCHIP
Quantity:
13 211
Part Number:
41CE5RM
Manufacturer:
ST
Quantity:
2 353
Part Number:
41CP6-1
Manufacturer:
SENSATA
Quantity:
20 000
The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
• Small form factor (0.020" diameter by 0.32" min. high)
• Low compression force (approx. 2.5 oz. min. per contact)
• Multiple beam structures
• Several points of contact per button
• Extremely lightweight
• Natural wiping action
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
CIN::APSE
High-Speed Interconnect Technology
THE BUTTON CONTACT
CIN::APSE APPLIED
®
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
1-2
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
• PC board to PC board (parallel processors,
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
multi-chip modules)
enhancement/mezzanine cards)
Step 2:
Add Z-Axis compression
and secure.
Call Toll Free: 1 (800) 323-9612

Related parts for 41C