41C Cinch Connectors, 41C Datasheet - Page 3
41C
Manufacturer Part Number
41C
Description
PLUG BUTTON .5" HOLE
Manufacturer
Cinch Connectors
Type
Body Plugr
Specifications of 41C
Color
Natural
Hole Diameter
0.500" (12.70mm)
Flange Diameter
0.656" (16.66mm)
External Diameter
16.67mm
Mounting Hole Dia
12.7mm
Accessory Type
Plug Button
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Panel Thickness
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
41C0R5
Manufacturer:
INFINEON
Quantity:
10 000
Company:
Part Number:
41C1000AJ60
Manufacturer:
WURTH
Quantity:
30 000
Company:
Part Number:
41C1R5
Manufacturer:
INFINEON
Quantity:
10 000
Company:
Part Number:
41CA
Manufacturer:
MICROCHIP
Quantity:
13 211
Part Number:
41CP6-1
Manufacturer:
SENSATA
Quantity:
20 000
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CIN::APSE
High-Speed Interconnect Technology
Contact Material: Molybdenum
CIN::APSE Contact Plating: Gold
Plunger Material: Copper alloy
Plunger Plating: Gold
Insulator Material: Liquid crystal polymer
Packaging Tray Material: Anti-static ABS
Button-Only Configuration with 0.020" (0.5 mm) Diameter
Temperature Life Testing: 1000 Hours @ 200°C
Thermal Shock: 2,000 Cycles @ 20°C to 110°C
Humidity: 5,000 Hours @ 30°C to 80°C, 80% RH
Salt Spray: 96 Hours
Low Temperature: Operates in liquid nitrogen (77°K)
Bellcore TR-NWT-001217: Passed with plungers
Button-Only Configuration with 0.020" (0.5 mm) Diameter
Button-Only Configuration with 0.020" (0.5 mm) diameter
Durability: 25,000 Z-axis actuations (CIN::APSE contact only)
Shock: 100 Gs; 6 milliseconds, no discontinuity
Vibration: 20 Gs; 10-20,000 Hz; no discontinuity
Call Toll Free: 1 (800) 323-9612
Dielectric Withstanding Voltage:
High signal speed capability enabling frequencies greater than 20 GHz.
Z-Axis, solderless, compression mount interconnect system.
Applications include production Land Grid Array (LGA) integrated circuit sockets, flex circuit to
PCB, and parallel PCB to PCB interconnections.
Provides solutions to many of the problems associated with through hole and surface mount
soldered technology.
Enables upgrade and system maintenance strategies.
Available in custom I/O configurations and I/O counts from 1 to over 5,000.
Offers low profile capabilities with compressed signal path length as short as 0.8 mm.
Contact centerline spacing of 1mm or greater.
Excellent reliability in commercial, military, and aerospace applications.
Application can result in lower installed and system maintenance costs.
Current-Carrying Capability:
greater than 2 nanoseconds
greater than 2 nanoseconds
Insulation Resistance:
®
DC Resistance:
Inductance:
15mΩ average
Less than 1 nH
Up to 3 Amps.
25,000 MegΩ @ 500 VDC
900 VAC at sea level
1-1
IC Component to Board Socket (LGA)
Flex Circuit to PCB
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