SC16C850LIET-S NXP Semiconductors, SC16C850LIET-S Datasheet - Page 47
![](/photos/31/46/314648/sot912-1_sml.jpg)
SC16C850LIET-S
Manufacturer Part Number
SC16C850LIET-S
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SC16C850LIET-S.pdf
(55 pages)
Specifications of SC16C850LIET-S
Transmitter And Receiver Fifo Counter
Yes
Data Rate
5Mbps
Mounting
Surface Mount
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Number Of Channels
1
Lead Free Status / RoHS Status
Compliant
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11. Package outline
Fig 23. Package outline SOT617-1 (HVQFN32)
SC16C850L
Product data sheet
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT617-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
0.30
0.18
8
1
b
IEC
- - -
0.2
9
32
c
e
D
5.1
4.9
(1)
3.25
2.95
D h
e 1
D h
D
All information provided in this document is subject to legal disclaimers.
MO-220
JEDEC
1/2
0
E
1.8 V single UART with 128-byte FIFOs and IrDA encoder/decoder
5.1
4.9
e
(1)
REFERENCES
b
Rev. 5 — 1 February 2011
3.25
2.95
E h
25
16
0.5
e
17
24
JEITA
scale
- - -
B
2.5
1/2
e
3.5
e
e 1
w
A
E
v
e 2
M
M
C
C
3.5
e 2
A
B
0.5
0.3
L
5 mm
0.1
A
v
A 1
y 1 C
0.05
w
PROJECTION
EUROPEAN
0.05
detail X
y
SC16C850L
0.1
y 1
X
C
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
01-08-08
02-10-18
SOT617-1
c
47 of 55
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