LUPA-4000-EVAL Cypress Semiconductor Corp, LUPA-4000-EVAL Datasheet - Page 25

• Manufacturer Part Number: LUPA-4000-EVAL
• Manufacturer: Cypress Semiconductor Corp

Specifications of LUPA-4000-EVAL

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Bonding Diagram
The die is bonded to the bonding pads of the package as shown in
Additional Package Information
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Document Number: 38-05712 Rev. *F
Die size: 25610 µm X 27200 µm
Cavity pad: 27000 µm X 29007 µm
Pixel 0,0 is located at 478 µm from the left hand side of the die and 1366 µm from the bottom side of the die.
Figure 24. Bonding Pads Diagram of the LUPA 4000 Package
Figure
24.
CYIL1SM4000AA
001-48359 **
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