MT47H64M8CF-25:F TR Micron Technology Inc, MT47H64M8CF-25:F TR Datasheet - Page 6

• Manufacturer Part Number: MT47H64M8CF-25:F TR
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H64M8CF-25:F TR

• Organization: 64Mx8
• Density: 512Mb
• Address Bus: 16b
• Access Time (max): 400ps
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 205mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

512Mb: x4, x8, x16 DDR2 SDRAM
Features
Figure 51: Bank Read – Without Auto Precharge ............................................................................................. 97
Figure 52: Bank Read – with Auto Precharge ................................................................................................... 98
t
t
Figure 53: x4, x8 Data Output Timing –
DQSQ,
QH, and Data Valid Window .................................................. 99
t
t
Figure 54: x16 Data Output Timing –
DQSQ,
QH, and Data Valid Window ..................................................... 100
t
t
Figure 55: Data Output Timing –
AC and
DQSCK ......................................................................................... 101
Figure 56: Write Burst ................................................................................................................................... 103
Figure 57: Consecutive WRITE-to-WRITE ...................................................................................................... 104
Figure 58: Nonconsecutive WRITE-to-WRITE ................................................................................................ 104
Figure 59: WRITE Interrupted by WRITE ....................................................................................................... 105
Figure 60: WRITE-to-READ ........................................................................................................................... 106
Figure 61: WRITE-to-PRECHARGE ................................................................................................................ 107
Figure 62: Bank Write – Without Auto Precharge ............................................................................................ 108
Figure 63: Bank Write – with Auto Precharge ................................................................................................. 109
Figure 64: WRITE – DM Operation ................................................................................................................ 110
Figure 65: Data Input Timing ........................................................................................................................ 111
Figure 66: Refresh Mode ............................................................................................................................... 112
Figure 67: Self Refresh .................................................................................................................................. 114
Figure 68: Power-Down ................................................................................................................................ 116
Figure 69: READ-to-Power-Down or Self Refresh Entry .................................................................................. 118
Figure 70: READ with Auto Precharge-to-Power-Down or Self Refresh Entry .................................................. 118
Figure 71: WRITE-to-Power-Down or Self Refresh Entry ................................................................................ 119
Figure 72: WRITE with Auto Precharge-to-Power-Down or Self Refresh Entry ................................................. 119
Figure 73: REFRESH Command-to-Power-Down Entry ................................................................................. 120
Figure 74: ACTIVATE Command-to-Power-Down Entry ................................................................................ 120
Figure 75: PRECHARGE Command-to-Power-Down Entry ............................................................................ 121
Figure 76: LOAD MODE Command-to-Power-Down Entry ............................................................................ 121
Figure 77: Input Clock Frequency Change During Precharge Power-Down Mode ........................................... 122
Figure 78: RESET Function ........................................................................................................................... 124
Figure 79: ODT Timing for Entering and Exiting Power-Down Mode .............................................................. 126
Figure 80: Timing for MRS Command to ODT Update Delay .......................................................................... 127
Figure 81: ODT Timing for Active or Fast-Exit Power-Down Mode ................................................................. 127
Figure 82: ODT Timing for Slow-Exit or Precharge Power-Down Modes ......................................................... 128
Figure 83: ODT Turn-Off Timings When Entering Power-Down Mode ............................................................ 128
Figure 84: ODT Turn-On Timing When Entering Power-Down Mode ............................................................. 129
Figure 85: ODT Turn-Off Timing When Exiting Power-Down Mode ............................................................... 130
Figure 86: ODT Turn-On Timing When Exiting Power-Down Mode ................................................................ 131
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512MbDDR2.pdf - Rev. Q 10/10 EN
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