MA4P506-30 TE Connectivity, MA4P506-30 Datasheet

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MA4P506-30

Manufacturer Part Number
MA4P506-30
Description
Manufacturer
TE Connectivity
Datasheet

Specifications of MA4P506-30

Lead Free Status / RoHS Status
Supplier Unconfirmed
1
M/A-COM Technology Solutions offers a comprehensive
line of low capacitance, planar and mesa, silicon PIN
diode chips which use ceramic glass and silicon nitride
passivation technology. The Silicon PIN Chip series of
devices cover a broad spectrum of performance
requirements for control circuit applications. They are
available in several choices of I-region lengths and have
been optimally designed to minimize parametric trade offs
when considering low capacitance, low series resistance,
and high breakdown voltages. Their small size and low
parasitics, make them an ideal choice for broadband, high
frequency, micro-strip hybrid assemblies.
The attenuator line of PIN diode chips are a planar or
mesa construction and because of their thicker I-regions
and predictable R
suited for low distortion attenuator and switch circuits.
Incorporated in the chip’s construction is M/A-COM
Tech’s, time proven, hard glass, CERMACHIP
hard glass passivation completely encapsulates the entire
PIN junction area resulting in a hermetically sealed chip
which has been qualified in many military applications.
These CERMACHIP
variety of voltage ratings, up to 3,000 volts and are
capable of controlling kilowatts of power.
Many of M/A-COM Tech’s silicon PIN diode chips are
also available in several different package styles.
Please consult the “Packaged PIN Diode Datasheet”
for case style availability and specifications. The
datasheet is located on the M/A-COM website at :
www.macomtech.com/DataSheets/packagedpindiodes.pdf
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Silicon PIN Chips
Switch & Attenuator Die
Extensive Selection of I-Region Lengths
Hermetic
Glass Passivated CERMACHIP
Oxide Passivated Planar Chips
Voltage Ratings to 3000V
Fast Switching Speed
Low Loss
High Isolation
RoHS Compliant
s
Description
vs. I characteristics, they are well
®
Features
diodes are available in a wide
®
®
. The
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Operating Temperature
1. Exceeding
Mounting Temperature
Power Dissipation (W)
Junction Temperature
Storage Temperature
Forward Current (I
Reverse Voltage (V
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
T
Visit www.macomtech.com for additional data sheets and product information.
damage to the chip
AMB
Parameter
Absolute Maximum Ratings
= +25°C
these
Full Area Cathode
(Unless otherwise specified)
R
F
)
)
limits
Absolute Maximum
Per Specification Table
+320°C for 10 seconds
Per P/N R
175°C –T
may
• China Tel: +86.21.2407.1588
-55°C to +175°C
-55°C to +200°C
cause
Value
Theta
+175°C
ambient
s
vs. I Graph
Anode
permanent
1
°C
V17

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MA4P506-30 Summary of contents

Page 1

Silicon PIN Chips Features Switch & Attenuator Die ♦ Extensive Selection of I-Region Lengths ♦ Hermetic ♦ Glass Passivated CERMACHIP ♦ Oxide Passivated Planar Chips ♦ Voltage Ratings to 3000V ♦ Fast Switching Speed ♦ Low Loss ♦ High Isolation ...

Page 2

Silicon PIN Chips Low Capacitance PIN Specification @ T Max. Rev. 3 Volt. V Part Number <10 µ MA4P161-134 100 MA4P203-134 100 MADP-000165-01340W 200 MADP-000135-01340W 200 Notes: 1. Nominal carrier life time,T 2. Nominal reverse recovery time ...

Page 3

... Max. Rev. 5 Volt. Part Number V < 10 µ MA4P303-134 200 MA4P404-132 250 MA4P504-132 500 MA4P505-131 500 MA4P506-131 500 MADP-000488-13740W 900 MA4P604-131 1000 MA4P606-131 1000 MA4P607-212 1000 1 2000 MA4PK2000-223 1 3000 MA4PK3000-1252 Notes: 1. Upon completion of installation into a circuit, the chip must be covered with a dielectric conformal coating such as SYLGARD 539 2 ...

Page 4

Silicon PIN Chips Typical Series Resistance vs. Forward Current Performance 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop ...

Page 5

Silicon PIN Chips MA4PK2000 & MA4PK3000 (2kV & 3kV) Chips 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop ...

Page 6

Silicon PIN Chips Die Handling and Mounting Information Handling: All semiconductor chips should be handled with care to avoid damage or contamination from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickup is strongly recommended ...

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