SSTUH32865ET-S NXP Semiconductors, SSTUH32865ET-S Datasheet - Page 26

• Manufacturer Part Number: SSTUH32865ET-S
• Manufacturer: NXP Semiconductors

Specifications of SSTUH32865ET-S

• Logic Family: SSTU
• Logical Function: Reg Bfr W/ParityTst
• Number Of Elements: 1
• Number Of Bits: 28
• Number Of Inputs: 28
• Number Of Outputs: 56
• High Level Output Current: -12mA
• Low Level Output Current: 12mA
• Propagation Delay Time: 3ns
• Operating Supply Voltage (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Clock-edge Trigger Type: Posit/Negat-Edge
• Polarity: Non-Inverting
• Technology: CMOS
• Frequency (max): 450(Min)MHz
• Mounting: Surface Mount
• Pin Count: 160
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Not Compliant

Philips Semiconductors
14. Revision history
Table 13:
9397 750 14136
Product data sheet
Document ID
SSTUH32865_1
Revision history
Release date
20050311
[4]
[5]
[6]
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[9]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Data sheet status
Product data sheet
Rev. 01 — 11 March 2005
1.8 V high output drive DDR registered buffer with parity
Change notice
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Doc. number
9397 750 14136
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SSTUH32865
Supersedes
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