LH79525N0M100A0,55 NXP Semiconductors, LH79525N0M100A0,55 Datasheet - Page 58
LH79525N0M100A0,55
Manufacturer Part Number
LH79525N0M100A0,55
Description
Manufacturer
NXP Semiconductors
Datasheet
1.LH79525N0M100A055.pdf
(64 pages)
Specifications of LH79525N0M100A0,55
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Applications
Embedded Control
Processing Unit
Microcontroller
Operating Supply Voltage (min)
1.7/3V
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
1.9/3.6V
Package Type
LQFP
Screening Level
Industrial
Pin Count
176
Mounting
Surface Mount
Rad Hardened
No
Lead Free Status / RoHS Status
Not Compliant
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LH79524/LH79525
58
LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT1019-1
OUTLINE
VERSION
max
1.7
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
M
T
P
K
H
F
D
B
R
N
G
C
L
J
E
A
1.35
1.20
A
2
1
IEC
2
0.5
0.4
b
3
Figure 42. Package outline SOT1019-1 (LFBGA208)
4
14.1
13.9
5
D
e
6
7
14.1
13.9
8
JEDEC
E
e
D
1
9
10
REFERENCES
1/2 e
0.8
11
e
Rev. 02 — 17 March 2009
NXP Semiconductors
0
12
13
e
12
14
1
b
15
16
JEITA
e
12
2
scale
5
1/2 e
0.15
B
e
v
∅ v
∅ w
e
A
E
M
M
2
0.08
w
C
C
A
10 mm
0.12
y
B
A
A
0.1
2
y
1
A
y
1
1
C
PROJECTION
EUROPEAN
detail X
C
X
y
Product data sheet
System-on-Chip
ISSUE DATE
07-07-07
07-07-07
SOT1019-1
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