UPD720114K9-4E4-A Renesas Electronics America, UPD720114K9-4E4-A Datasheet - Page 33

• Manufacturer Part Number: UPD720114K9-4E4-A
• Manufacturer: Renesas Electronics America

Specifications of UPD720114K9-4E4-A

• Lead Free Status / RoHS Status: Supplier Unconfirmed

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representative.
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Note The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a
Infrared reflow
Partial heating method
μ
μ
μ
PD720114GA-9EU-A: 48-pin plastic TQFP (Fine pitch) (7 × 7)
PD720114GA-YEU-A: 48-pin plastic TQFP (Fine pitch) (7 × 7)
PD720114K9-4E4-A: 40-pin plastic QFN (6 × 6)
The
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
RECOMMENDED SOLDERING CONDITIONS
μ
relative humidity of 20 to 65% after dry-pack package is opened.
PD720114 should be soldered and mounted under the following recommended conditions.
Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less
(220 °C or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
afterwards),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each side of the device) ,
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
Note
: 7 days (10 to 72 hours pre-backing is required at 125C°
Data Sheet S17462EJ6V0DS
Soldering Conditions
μ
PD720114
IR60-107-3
Symbol
–
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