FDC37C669-MS Standard Microsystems (SMSC), FDC37C669-MS Datasheet - Page 160

• Manufacturer Part Number: FDC37C669-MS
• Manufacturer: Standard Microsystems (SMSC)

Specifications of FDC37C669-MS

• Pin Count: 100
• Lead Free Status / RoHS Status: Compliant

TD(1)
TE(1)
TD(2)
TE(2)
-C-
D IM
A1
A2
D1
E1
L1
W
D
H
A
E
L
e
0
H
0. 10
E
A
22. 21
16. 27
21 .8
15 .8
2. 80
2. 57
23 .4
19 .9
17 .4
13 .9
0. 65
MIN
0°
0.1
0.1
1.8
.2
A1
0.65 BSC
E1
FIGURE 22 - 100 PIN QFP PACKAGE OUTLINE
A2
22. 76
16. 82
24. 15
18. 15
MAX
22 .2
16 .2
3. 15
0. 45
2. 87
20 .1
14 .1
0. 95
12°
0.2
2.6
.4
.1 10
.0 04
.1 01
.9 21
.7 83
.6 85
.5 47
.0 04
.0 26
.0 71
MIN
.0 08
.8 58
.6 22
.8 74
.6 41
0°
.0256 BS C
MAX
.1 24
.0 18
.1 13
.9 51
.7 91
.7 15
.5 55
.0 08
.0 37
.1 02
.0 16
.8 74
.6 38
.8 96
.6 62
TD /TE
12°
D1
D
160
Not es :
1) C oplanarity is 0.1 0 0mm (. 00 4") maximum.
2) Toleranc e on th e posit ion o f the leads is
0.2 00mm (. 00 8") maximum.
3) Pack age body d imensions D1 and E1 do not
include the mold pro trus ion. Ma ximum mold
pr otrusio n is 0 .25mm (. 01 0").
4 ) Dimensions TD and TE are impo rt ant f or testing
by robotic ha n dler. Only above c ombinatio ns of (1)
or (2) are acc eptable.
5) Cont rolling dimension: millimeter . D imensions
in inches for reference only and not n ec es sarily
accurate.
L1
L
0
e
W