5962-8959820MZA QP SEMICONDUCTOR, 5962-8959820MZA Datasheet - Page 47
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5962-8959820MZA
Manufacturer Part Number
5962-8959820MZA
Description
Manufacturer
QP SEMICONDUCTOR
Datasheet
1.5962-8959820MZA.pdf
(91 pages)
Specifications of 5962-8959820MZA
Lead Free Status / RoHS Status
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DSCC FORM 2234
APR 97
C20.1
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited
in the solicitation or contract.
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
text of this drawing shall take precedence.
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The
modification in the QM plan shall not effect the form, fit or function as described herein.
specified in MIL-PRF-38535 and the manufacturer’s QM plan, for device classes Q and V and herein.
as specified in 10.2.4.2 and on figure A-1.
(Copies of these documents are available online at
C10.2.5.3. Interface materials.
C10.2.5.4. Assembly related information.
C10.3. Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details.
C10.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details.
C20. APPLICABLE DOCUMENTS.
C20.2. Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
C30. REQUIREMENTS
C30.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
C30.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as
C30.2.1 Die physical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1.
C30.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be
C30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1.
DEPARTMENT OF DEFENSE SPECIFICATION
DEPARTMENT OF DEFENSE STANDARDS
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
MIL-STD-883
MIL-HDBK-103 -
MIL-HDBK-780 -
DEFENSE SUPPLY CENTER COLUMBUS
Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
STANDARD
-
Die type
Die type
Test Method Standard Microcircuits.
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
01
01
FORMS A PART OF SMD 5962-89598
APPENDIX C – Continued.
http://assist.daps.dla.mil/quicksearch/
SIZE
A
Figure number
Figure number
A-1
A-1
REVISION LEVEL
or
R
http://assist.daps.dla.mil
SHEET
5962-89598
or
47