MT8JSF12864HY1G1D1 Micron Technology Inc, MT8JSF12864HY1G1D1 Datasheet
MT8JSF12864HY1G1D1
Specifications of MT8JSF12864HY1G1D1
Related parts for MT8JSF12864HY1G1D1
MT8JSF12864HY1G1D1 Summary of contents
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... MT8JSF25664H – 2GB Features • DDR3 functionality and operations supported as de- fined in the component data sheet • 204-pin, small-outline dual in-line memory module (SODIMM) • Fast data transfer rates: PC3-12800, PC3-10600, PC3-8500, or PC3-6400 • 1GB (128 Meg x 64) and 2GB (256 Meg x 64) • ...
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... Table 2: Addressing Parameter Refresh count Row address Device bank address Device configuration Column address Module rank address Table 3: Part Numbers and Timing Parameters – 1GB Modules 1 Base device: MT41J128M8, 1Gb DDR3 SDRAM 2 Part Number Module Density MT8JSF12864H(I)Y-1G6__ MT8JSF12864H(I)Y-1G4__ MT8JSF12864H(I)Y-1G1__ Table 4: Part Numbers and Timing Parameters – 2GB Modules ...
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Pin Assigments and Descriptions Table 5: Pin Assignments 204-Pin DDR3 SODIMM Front Pin Symbol Pin Symbol Pin DQ19 105 REFDQ 107 DQ0 57 DQ24 109 7 DQ1 59 DQ25 111 ...
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... Input with write data. Center-aligned with write data. SDA I/O Serial data: SDA is a bidirectional pin used to transfer addresses and data into and out of the temperature sensor/SPD EEPROM on the module on the I PDF: 09005aef82b36df5 Rev. C 8/09 EN 1GB, 2GB (x64, SR) 204-Pin DDR3 SDRAM SODIMM ...
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... Ground Supply Termination voltage: Used for control, command, and address (V TT – connect: These pins are not connected on the module. – function: Connected within the module, but provides no functionality. PDF: 09005aef82b36df5 Rev. C 8/09 EN 1GB, 2GB (x64, SR) 204-Pin DDR3 SDRAM SODIMM . /2). ...
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... DQ Map Table 7: Component-to-Module DQ Map Component Reference Component Number DQ Module PDF: 09005aef82b36df5 Rev. C 8/09 EN 1GB, 2GB (x64, SR) 204-Pin DDR3 SDRAM SODIMM Component Module Pin Reference Number Number 141 U4 36 130 38 140 33 131 35 143 32 129 39 142 37 132 61 182 U7 62 192 57 183 58 191 60 180 ...
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Functional Block Diagram Figure 2: Functional Block Diagram S0# DQS0# DQS0 DM0 DM CS# DQS DQS# DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ U1 DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQS1# DQS1 DM1 DM ...
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... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...
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... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...
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... Component specifications are available on Micron’s Web site. Module speed grades cor- relate with component speed grades, as shown below. Table 10: Module and Component Speed Grades DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1G6 ...
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I Specifications DD Table 11: DDR3 I Specifications and Conditions – 1GB DD Values are for the MT41J128M8 DDR3 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) component data sheet Parameter Operating current ...
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Table 12: DDR3 I Specifications and Conditions – 2GB DD Values are for the MT41J256M8 DDR3 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) component data sheet Parameter Operating current 0: One bank ...
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... TSE2002av, Serial Presence Detect with Temperature Sensor.” Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE- DEC standard JC-45, “Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Modules.” ...
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Table 14: Sensor and EEPROM Serial Interface Timing (Continued) Parameter/Condition Start condition setup time Stop condition setup time EVENT# Pin The temperature sensor also adds the EVENT# pin (open drain). Not used by the SPD EEPROM, EVENT temperature ...
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Figure 3: EVENT# Pin Functionality Critical Alarm window (MAX) Alarm window (MIN) EVENT# interrupt mode EVENT# comparator mode EVENT# critical temperature only mode Table 15: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register ...
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Table 16: Pointer Register Bits 0– Table 17: Pointer Register Bits 0–2 Descriptions Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. ...
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Table 19: Capability Register Bit Description (Continued) Bit Description 4:3 Temperature resolution 00: 0.5°C LSB 01: 0.25°C LSB 10: 0.125°C LSB 11: 0.0625°C LSB 15:5 0: Must be set to zero Configuration Register Table 20: Configuration Register (Address: 0x01) 15 ...
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Table 21: Configuration Register Bit Descriptions (Continued) Bit Description 6 Alarm window lock bit 0: Alarm trips are not locked and can be changed 1: Alarm trips are locked and cannot be changed 7 Critical trip lock bit 0: Critical ...
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Figure 4: Hysteresis Applied to Temperature Around Trip Points Below window bit Above window bit 1. T Notes Hyst is the value set in the hysteresis bits of the configuration register. Table 22: Hysteresis Applied to Alarm ...
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Temperature Trip Point Registers The upper and lower temperature boundary registers are used to set the maximum and minimum values of the alarm window. LSB for these registers is 0.25°C. All RFU bits in the register will always report zero. ...
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Table 26: Temperature Register (Address: 0x05 Above Above Below MSB critical alarm alarm trip window window Table 27: Temperature Register Bit Descriptions Bit Description 13 Below alarm window 0: Temperature is equal to or above the lower ...
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... TYP Back view U10 3.0 (0.12) TYP 39.0 (1.535) 21.0 (0.827) TYP 24.8 (0.976) times occur. 22 Module Dimensions U4 30.15 (1.187) 29.85 (1.175) 20.0 (0.787) TYP Pin 203 TYP U9 4.0 (0.157) TYP Pin 2 TYP TYP Micron Technology, Inc. reserves the right to change products or specifications without notice. ...