NAND32GAH0HZA5E Micron Technology Inc, NAND32GAH0HZA5E Datasheet - Page 9
NAND32GAH0HZA5E
Manufacturer Part Number
NAND32GAH0HZA5E
Description
Manufacturer
Micron Technology Inc
Datasheet
1.NAND32GAH0HZA5E.pdf
(29 pages)
Specifications of NAND32GAH0HZA5E
Operating Temperature (max)
85C
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
NAND32GAH0H, NAND64GAH0H
3.1
Figure 2.
1. The ball corresponding to V
3.2
Figure 3.
14
13
12
11
10
9
8
7
6
5
4
3
2
1
NC
NC
NC
NC
A
NC
NC
B
Package connections
LFBGA169 package connections (top view through package)
Form factor
The ball diameter, d, and the ball pitch, p, for the LFBGA169 package are:
Form factor
C
NC
NC
D
d = 0.30 mm (solder ball diameter)
p = 0.5 mm (ball pitch)
E
F
CCI
G
must be decoupled with an external capacitance.
DAT2
DAT1
DAT0
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
H
DAT7
DAT6
DAT5
DAT4
DAT3
NC
NC
NC
NC
NC
NC
NC
NC
NC
J
V CCQ
d
V CCQ
V SSQ
V CCI
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
K
NC
NC
NC
NC
NC
NC
NC
L
V SS
V CC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
M
V CC
NC
NC
NC
NC
NC
NC
NC
N
V SS
NC
NC
NC
NC
NC
NC
NC
NC
P
V SS
NC
NC
NC
NC
NC
NC
NC
R
V CC
NC
NC
NC
NC
NC
NC
NC
T
NC
V CC
V SS
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
U
NC
NC
NC
NC
NC
NC
V
p
NC
V CCQ
CMD
CLK
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
W
V CCQ
V SSQ
V SSQ
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Y
Device physical description
V CCQ
V SSQ
V CCQ
V SSQ
NC
NC
NC
NC
NC
NC
NC
NC
NC
AA
NC
AB
AC
AD
NC
AE
NC
AF
AI13627
NC
NC
AG
NC
NC
NC
NC
AH
9/29
AI13626