NAND32GAH0HZA5E Micron Technology Inc, NAND32GAH0HZA5E Datasheet - Page 23
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NAND32GAH0HZA5E
Manufacturer Part Number
NAND32GAH0HZA5E
Description
Manufacturer
Micron Technology Inc
Datasheet
1.NAND32GAH0HZA5E.pdf
(29 pages)
Specifications of NAND32GAH0HZA5E
Operating Temperature (max)
85C
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
NAND32GAH0H, NAND64GAH0H
Table 9.
1. TBD stands for ‘to be defined’.
2. Reserved bits should read as ‘0’.
Reserved
Command set revision
Reserved
Power class
Reserved
High speed interface
timing
Reserved
Bus width mode
Reserved
Erased memory content
Reserved
Boot configuration
Reserved
Boot bus width 1
Reserved
High-density erase group
definition
Reserved
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
Name
Extended CSD
CMD_SET_REV
POWER_CLASS
HS_TIMING
BUS_WIDTH
ERASED_MEM_CONT
BOOT_CONFIG
BOOT_BUS_WIDTH
ERASE_GROUP_DEF
(1)
(continued)
Field
Size (bytes)
175
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Cell type
R/W
R/W
R/W
R/W
R/W
WO
RO
RO
CSD-slice
[174:0]
[189]
[190]
[188]
[187]
[186]
[185]
[184]
[183]
[182]
[181]
[180]
[179]
[178]
[177]
[176]
[175]
Device registers
CSD-slice
value
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
0
0
0
2
0
0
0
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