MT45W2MW16PFA-70 Micron Technology Inc, MT45W2MW16PFA-70 Datasheet - Page 33

• Manufacturer Part Number: MT45W2MW16PFA-70
• Manufacturer: Micron Technology Inc

Specifications of MT45W2MW16PFA-70

• Lead Free Status / RoHS Status: Not Compliant

Revision History
• Rev G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10/05
• Rev F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 04/05
• Rev. E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12/04
• Rev. D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 09/04
• Rev. C, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 05/04
• Rev. B, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12/03
PDF: 09005aef80be1ee8/Source: 09005aef80be1f7f
AsyncCellularRAM_2.fm - Rev. G 10/05 EN
• Added new P25A-specific note to the cover page.
• Removed 60ns support.
• Corrected typographic errors.
• Removed all references to 32Mb density.
• Added Table 6, Maximum Standby Currents for Applying PAR and TCR Settings, on
• Added Table 7, Maximum Standby Currents for Applying PAR and TCR Settings –
• Added Figure 13, Typical Refresh Current vs. Temperature (I
• Added “Maximum and Typical Standby Currents” on page 19
• WE# LOW limited to
• Last address changed by software access sequence.
• Noted software access third cycle must be CE#-controlled WRITE.
• Change
• Clarified TCR temperatures and setting in Table 6.
• Changed VccQ Option W to 1.70V–3.30V.
• Changed wireless temperature range to -30°C.
• Noted input HIGH voltage not aligned with the Working Group specification of
• Noted wireless temp (MIN) exceeds the Working Group spec.
• Clarified CE# LOW time limited by refresh—must not stay LOW longer than
• Changed
• Clarified address A[4] and higher in page mode.
• Clarified I
• Changed PAR options to full, one-half, one-quarter, one-eighth, or none.
• Deleted Appendix A (extended timings and all references).
• Added C
• Replaced Abbreviated Component Marks table with Part Numbering chart.
• Added measurement time clarification to I
• Corrected package nomenclature to VFBGA.
• WE# LOW limited to
• Last address changed by software access sequence.
• Noted software access third cycle must be CE#-controlled WRITE.
• Change
• Prohibited DPD via software access.
• Updated Appendix regarding async page mode.
• Added
• Added “Access Using ZZ#” section.
• Added software access section.
page 19
Low-Power (L), on page 19
0.4.
represented.
t
WPH,
t
t
IN
CEH to
CEH to
t
CC
CEM MAX to 8.
and C
and updated symbols.
64Mb: 4 Meg x 16 Async/Page CellularRAM 1.0 Memory
t
CEM, and
t
t
IO
CPH.
CPH.
MIN values.
t
t
CEM for WRITEs.
CEM for WRITES.
t
CW to tables and figures where not already appropriately
33
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SB
and I
PAR
notes
TCR
©2003 Micron Technology, Inc. All rights reserved.
), on page 20
Revision History
t
CEM.
V
CC
Q -