W86L157SYG Winbond, W86L157SYG Datasheet - Page 7

• Manufacturer Part Number: W86L157SYG
• Manufacturer: Winbond

Specifications of W86L157SYG

• Lead Free Status / RoHS Status: Compliant

4. PIN DESCRIPTIONS
4.1 W86L157Y Pin Descriptions (64-pin)
MMC Interface:
Flash Memory or ROM Interface Signal:
15~23
29~36
49~54
PIN
64
58
59
62
56
10
11
12
13
4
5
6
1
FSCMR/A27
FWEN/A24
FWPN/A23
FCLE/A26
DAT/CDO
FALE/A25
CMD/CDI
A[17:22]
A[9:16]
NAME
CSAN
CSBN
CSCN
CSDN
A[0:8]
CLK
CS
DO/DIO
DO/DIO
DO/DIO
DO/DIO
DO/DIO
DO/DIO
DO/DIO
DO/DIO
DB/DO
DI/DO
DO/DI
DO/DI
DO/DI
DB/DI
TYPE
DI
DI
MMC mode: Data line
SPI mode: Card data output.
SPI mode: Card select input, active low.
MMC mode: Command response.
SPI mode: Card data input.
Clock input signal of MMC card.
Flash Single ComMand Read set in flash memory, Address
line 27 of ROM. If the flash ID number can not recognized,
flash memory is single command read if this pin is high and
is two command read if low. Always input when flash
memory select.
Command Latch Enable of flash memory, Address line 26 of
ROM.
Address Latch Enable of flash memory, Address line 25 of
ROM.
Write Enable of flash memory, Address line 24 of ROM.
Write Protect of flash memory, Address line 23 of ROM.
Address line [0:8] of ROM.
Address line [9:16] of ROM.
Address line [17:22] of ROM.
Chip select output pin of flash memory A or ROM A, active
low.
Chip select output pin of flash memory B or ROM B, active
low and input during reset. This pin is disable and single
flash or ROM is connected if input low during reset. Weak
pull high is drive and will change to weak pull low when
single flash or ROM is used.
Chip select output pin of flash memory C or ROM C, active
low and input during reset. Weak pull high is drive and will
change to weak pull low when 4 flashs or ROMs are used.
Chip select output pin of flash memory D or ROM D, active
low and input during reset. Weak pull hign is drive and will
change to weak pull low when 4 flashs or ROMs are used.
- 4 -
W86L157 Preliminary
DESCRIPTION