W86L157SYG Winbond, W86L157SYG Datasheet - Page 22

• Manufacturer Part Number: W86L157SYG
• Manufacturer: Winbond

Specifications of W86L157SYG

• Lead Free Status / RoHS Status: Compliant

Schematic discription CSBN connet to GND (R1: Short)
Categlory
Samsung
Flash list
VDD
FCLE
FALE
FWEn
FWPn
FR_B
nRE_nOE
CSA
CSB
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1
2
3
4
5
6
7
8
9
K9K4G08U0M,K9K2G08U0M,
K9F2G08U0M,K9F1G08U0M,
K9F1G08U0A,K9K1G08U0M,
K9K1G08U0A,K9F1208U0M,
K9F1208U0A, K9F5608U0C.
NC
NC
NC
NC
NC
NC
R/B
RE
CE
NC/CE2
NC
VCC
VSS
NC
NC
CLE
ALE
WE
WP
NC
NC
NC
NC
NC
One CE pin
U3
Samsung
- 19 -
CSBN connect to Flash CE2 (Flash chip
enable2) (R1: open)
Publication Release Date: December 2, 2004
W86L157 Preliminary
K9W8G08U1M
K9W4G08U1M
Two CE pins
VCC
PRE
I/O7
I/O6
I/O5
I/O4
VSS
I/O3
I/O2
I/O1
I/O0
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
FD7
FD6
FD5
FD4
VDD
FD3
FD2
FD1
FD0
Revision 0.7