IS42S32200B7TL ISSI, Integrated Silicon Solution Inc, IS42S32200B7TL Datasheet

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IS42S32200B7TL

Manufacturer Part Number
IS42S32200B7TL
Description
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Datasheet

Specifications of IS42S32200B7TL

Organization
2Mx32
Density
64Mb
Address Bus
13b
Access Time (max)
7ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
180mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
IS42S32200B
512K Bits x 32 Bits x 4 Banks (64-MBIT)
SYNCHRONOUS DYNAMIC RAM
FEATURES
• Clock frequency: 166, 143 MHz
• Fully synchronous; all signals referenced to a
• Internal bank for hiding row access/precharge
• Single 3.3V power supply
• LVTTL interface
• Programmable burst length:
• Programmable burst sequence:
• Self refresh modes
• 4096 refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
• Burst termination by burst stop and precharge
• Industrial temperature availability
• Package 400-mil 86-pin TSOP II
• Lead free package is available
Integrated Silicon Solution, Inc. — www.issi.com —
R e v . 0 0 C
09/29/03
PIN DESCRIPTIONS
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
A0-A10
BA0, BA1
DQ0 to DQ31
CLK
CKE
CS
RAS
CAS
WE
DQM0 to DQM3 Input/Output Mask
positive clock edge
(1, 2, 4, 8, full page)
Sequential/Interleave
operations capability
command
Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
Write Enable
1-800-379-4774
OVERVIEW
ISSI
organized as 524,288 bits x 32-bit x 4-bank for improved
performance. The synchronous DRAMs achieve high-
speed data transfer using pipeline architecture. All inputs
and outputs signals refer to the rising edge of the clock
input.
PIN CONFIGURATION
(86-Pin TSOP (Type II)
V
GND
V
GND
NC
DD
DDQ
A10/AP
GNDQ
GNDQ
GNDQ
GNDQ
DQM0
DQM2
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
V
V
V
V
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
CAS
RAS
BA0
BA1
's 64Mb Synchronous DRAM IS42S32200B is
V
DDQ
DDQ
V
V
DDQ
DDQ
V
WE
NC
CS
NC
NC
A0
A1
A2
DD
DD
DD
DD
Q
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
Power
Ground
Power Supply for DQ Pin
Ground for DQ Pin
No Connection
PRELIMINARY INFORMATION
September 2003
ISSI
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
GND
DQ15
GNDQ
DQ14
DQ13
V
DQ12
DQ11
GNDQ
DQ10
DQ9
V
DQ8
NC
GND
DQM1
NC
NC
CLK
CKE
A9
A8
A7
A6
A5
A4
A3
DQM3
GND
NC
DQ31
V
DQ30
DQ29
GNDQ
DQ28
DQ27
V
DQ26
DQ25
GNDQ
DQ24
GND
DDQ
DDQ
DDQ
DDQ
®
1

Related parts for IS42S32200B7TL

IS42S32200B7TL Summary of contents

Page 1

... September 2003 OVERVIEW ISSI 's 64Mb Synchronous DRAM IS42S32200B is organized as 524,288 bits x 32-bit x 4-bank for improved performance. The synchronous DRAMs achieve high- speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. PIN CONFIGURATION ...

Page 2

... IS42S32200B GENERAL DESCRIPTION The 64Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in 3.3V memory systems containing 67,108,864 bits. Internally configured as a quad-bank DRAM with a synchronous interface. Each 16,777,216-bit bank is organized as 2,048 rows by 256 columns by 32 bits. The 64Mb SDRAM includes an AUTO REFRESH MODE, and a power-saving, power-down mode ...

Page 3

IS42S32200B PIN FUNCTIONS Symbol Pin No. Type A0-A10 Input Pin BA0, BA1 22,23 Input Pin CAS 18 Input Pin CKE 67 Input Pin CLK 68 Input Pin CS 20 Input Pin DQ0 to ...

Page 4

... LOW, the corresponding buffer byte is enabled, and when HIGH, disabled. The outputs go to the HIGH Impedance State when DQMx is HIGH. This function corresponds conventional DRAMs. In write mode, DQMx control the input buffer. When DQMx is LOW, the corresponding buffer byte is enabled, and data can be written to the device. ...

Page 5

... During the SELF REFRESH operation, the row address to be refreshed, the bank, and the refresh interval are generated automatically internally. SELF REFRESH can be used to retain data in the SDRAM without external clocking, even if the rest of the system is powered down. The SELF REFRESH operation is started by dropping the CKE pin from HIGH to LOW. During the SELF REFRESH operation all other inputs to the SDRAM become “ ...

Page 6

IS42S32200B TRUTH TABLE – COMMANDS AND DQM OPERATION FUNCTION COMMAND INHIBIT (NOP) NO OPERATION (NOP) ACTIVE (Select bank and activate row) READ (Select bank/column, start READ burst) WRITE (Select bank/column, start WRITE burst) BURST TERMINATE PRECHARGE (Deactivate row in bank ...

Page 7

... NOTES: 1. CKEn is the logic state of CKE at clock edge n ; CKEn-1 was the state of CKE at the previous clock edge. 2. Current state is the state of the SDRAM immediately prior to clock edge COMMANDn is the command registered at clock edge n , and ACTONn is a result of COMMANDn. 4. All states and sequences not shown are illegal or reserved. ...

Page 8

... Accessing Mode Register: Starts with registration of a LOAD MODE REGISTER command and ends when met, the SDRAM will be in the all banks idle state. MRD Precharging All: Starts with registration of a PRECHARGE ALL command and ends when t banks will be in the idle state. ...

Page 9

IS42S32200B TRUTH TABLE – CURRENT STATE BANK n, COMMAND TO BANK m CURRENT STATE COMMAND (ACTION) Any COMMAND INHIBIT (NOP/Continue previous operation) NO OPERATION (NOP/Continue previous operation) Any Command Otherwise Allowed to Bank m Idle Row ACTIVE (Select and activate ...

Page 10

IS42S32200B 7. READs or WRITEs to bank m listed in the Command (Action) column include READs or WRITEs with auto precharge enabled and READs or WRITEs with auto precharge disabled. 8. CONCURRENT AUTO PRECHARGE: Bank n will initiate the AUTO ...

Page 11

... IS42S32200B FUNCTIONAL DESCRIPTION The 64Mb SDRAMs 512K banks) are quad-bank DRAMs which operate at 3.3V and include a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the 16,777,216-bit banks is organized as 2,048 rows by 256 columns by 32bits. Read and write accesses to the SDRAM are burst oriented; ...

Page 12

... IS42S32200B REGISTER DEFINITION Mode Register The mode register is used to define the specific mode of operation of the SDRAM. This definition includes the selection of a burst length, a burst type, a CAS\ latency, an operating mode and a write burst mode, as shown in MODE REGISTER DEFINITION. The mode register is programmed via the LOAD MODE ...

Page 13

... IS42S32200B Burst Length Read and write accesses to the SDRAM are burst ori- ented, with the burst length being programmable, as shown in MODE REGISTER DEFINITION. The burst length determines the maximum number of column loca- tions that can be accessed for a given READ or WRITE command. Burst lengths locations are ...

Page 14

IS42S32200B CAS Latency The CAS latency is the delay, in clock cycles, between the registration of a READ command and the availability of the first piece of output data. The latency can be set to two or three clocks. If ...

Page 15

... OPERATION BANK/ROW ACTIVATION Before any READ or WRITE commands can be issued to a bank within the SDRAM, a row in that bank must be “opened.” This is accomplished via the ACTIVE command, which selects both the bank and the row to be activated (see Activating Specific Row Within Specific Bank). ...

Page 16

... READ burst, provided that DQ contention can be avoided given system design, there may be a possibility that the device driving the input data will go Low-Z before the SDRAM DQs go High-Z. In this case, at least a single-cycle delay should occur between the last read data and the WRITE command. ...

Page 17

IS42S32200B same bank. The PRECHARGE command should be issued x cycles before the clock edge at which the last desired data element is valid, where x equals the CAS latency minus one. This is shown in the READ to PRECHARGE ...

Page 18

IS42S32200B Consecutive READ Bursts T0 CLK COMMAND READ BANK, ADDRESS COL n DQ CAS Latency - CLK COMMAND READ NOP BANK, ADDRESS COL n DQ CAS Latency - NOP NOP NOP ...

Page 19

IS42S32200B Random READ Accesses T0 CLK COMMAND READ BANK, ADDRESS COL CLK COMMAND READ BANK, ADDRESS COL n DQ CAS Latency - 3 Integrated Silicon Solution, Inc. — www.issi.com — ...

Page 20

IS42S32200B RW1 - READ to WRITE CLK DQM COMMAND ADDRESS DQ RW2 - READ to WRITE With Extra Clock Cycle T0 CLK DQM COMMAND READ BANK, ADDRESS COL READ NOP NOP BANK, COL ...

Page 21

IS42S32200B READ to PRECHARGE T0 T1 CLK COMMAND READ NOP BANK a, ADDRESS COL n DQ CAS Latency - CLK COMMAND READ NOP BANK, ADDRESS COL n DQ CAS Latency - 3 Integrated Silicon Solution, Inc. — ...

Page 22

IS42S32200B READ Burst Termination T0 CLK COMMAND READ BANK a, ADDRESS COL n DQ CAS Latency - CLK COMMAND READ NOP BANK, ADDRESS COL n DQ CAS Latency - BURST NOP ...

Page 23

... An example is shown in WRITE to WRITE diagram. Data either the last of a burst of two or the last desired of a longer burst. The 64Mb SDRAM uses a pipelined architecture and therefore does not require the 2n rule associated with a prefetch architecture. A WRITE command can be initiated on any clock cycle following a previous WRITE command ...

Page 24

IS42S32200B WRITE Burst COMMAND ADDRESS Burst length = 2 DQM ix low. WRITE to WRITE DQMx is low. Each Write Command may be to any bank. Random WRITE Cycles COMMAND ADDRESS DQMx is low. Each Write Command may be to ...

Page 25

IS42S32200B WRITE to READ T0 CLK COMMAND WRITE BANK, ADDRESS COL WRITE to PRECHARGE ( CLK DQM COMMAND WRITE BANK a, ADDRESS COL Integrated Silicon Solution, Inc. — www.issi.com ...

Page 26

IS42S32200B WRITE to PRECHARGE ( CLK DQM WRITE COMMAND BANK a, ADDRESS COL WRITE Burst Termination COMMAND ADDRESS 26 2 CLK ( NOP NOP PRECHARGE BANK ...

Page 27

IS42S32200B PRECHARGE The PRECHARGE command (see figure) is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row access some specified time (t the ...

Page 28

IS42S32200B CLOCK SUSPEND Clock suspend mode occurs when a column access/burst is in progress and CKE is registered LOW. In the clock suspend mode, the internal clock is deactivated, “freezing” the synchronous logic. For each positive clock edge on which ...

Page 29

... CONCURRENT AUTO PRECHARGE An access command (READ or WRITE) to another bank while an access command with auto precharge enabled is executing is not allowed by SDRAMs, unless the SDRAM supports CONCURRENT AUTO PRECHARGE. ISSI Fig CAP 1 - READ With Auto Precharge interrupted by a READ T0 ...

Page 30

IS42S32200B WRITE with Auto Precharge 3. Interrupted by a READ (with or without auto precharge): A READ to bank m will interrupt a WRITE on bank n when registered, with the data-out appearing CAS latency later. The PRECHARGE to bank ...

Page 31

IS42S32200B ABSOLUTE MAXIMUM RATINGS Symbol Parameters V Maximum Supply Voltage DD MAX V Maximum Supply Voltage for Output Buffer DDQ MAX V Input Voltage IN V Output Voltage OUT P Allowable Power Dissipation D MAX I Output Shorted Current CS ...

Page 32

IS42S32200B DC ELECTRICAL CHARACTERISTICS Input Leakage Current IL I Output Leakage Current OL V Output High Voltage Level OH V Output Low Voltage Level ...

Page 33

IS42S32200B AC ELECTRICAL CHARACTERISTICS Symbol Parameter t Clock Cycle Time CK3 t CK2 t Access Time From CLK (4) AC3 t AC2 t CLK HIGH Level Width CHI t CLK LOW Level Width CL t Output Data Hold Time OH ...

Page 34

IS42S32200B AC ELECTRICAL CHARACTERISTICS Symbol Parameter t Input Data To Precharge DPL3 Command Delay time t DPL2 Input Data To Active / Refresh CAS Latency = 3 t DAL3 Command Delay time (During Auto-Precharge) t DAL2 t Transition Time (2) ...

Page 35

IS42S32200B OPERATING FREQUENCY / LATENCY RELATIONSHIPS SYMBOL PARAMETER — Clock Cycle Time — Operating Frequency t READ/WRITE command to READ/WRITE command CCD t CKE to clock disable or power-down entry mode CKED t CKE to clock enable or power-down exit ...

Page 36

IS42S32200B INITIALIZE AND LOAD MODE REGISTER CLK CKS CKH CKE CMH CMS CMH CMS COMMAND NOP PRECHARGE DQM0-DQM3 A0-A9 ALL BANKS A10 SINGLE BANK BA0, BA1 ALL BANKS DQ T ...

Page 37

IS42S32200B POWER-DOWN MODE CYCLE T0 CLK t t CKS CKH CKE t t CMS CMH COMMAND PRECHARGE DQM0-DQM3 A0-A9 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK DQ High-Z All banks idle, enter Precharge all active ...

Page 38

IS42S32200B CLOCK SUSPEND MODE CLK CKS CKH CKS CKE t t CMS CMH COMMAND READ NOP t t CMS CMH DQM0-DQM3 A0-A9 (2) COLUMN ...

Page 39

IS42S32200B AUTO-REFRESH CYCLE CLK t t CKS CKH CKE t t CMS CMH PRECHARGE NOP COMMAND DQM0-DQM3 A0-A9 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK ( High-Z CAS latency = 2, ...

Page 40

IS42S32200B SELF-REFRESH CYCLE T0 t CLK CKS CKH CKE t t CMS CMH COMMAND PRECHARGE NOP DQM0-DQM3 A0-A9 ALL BANKS A10 SINGLE BANK BA0, BA1 BANK DQ High-Z t Precharge all active banks ...

Page 41

IS42S32200B READ WITHOUT AUTO PRECHARGE CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9 ROW A10 ROW t t DISABLE AUTO PRECHARGE ...

Page 42

IS42S32200B READ WITH AUTO PRECHARGE CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9 ROW ENABLE AUTO PRECHARGE A10 ROW t t ...

Page 43

IS42S32200B SINGLE READ WITHOUT AUTO PRECHARGE CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9 ROW A10 ROW ...

Page 44

IS42S32200B SINGLE READ WITH AUTO PRECHARGE CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9, ROW A10 ROW ...

Page 45

IS42S32200B ALTERNATING BANK READ ACCESSES CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9 ROW ENABLE AUTO PRECHARGE A10 ROW t t ...

Page 46

IS42S32200B READ - FULL-PAGE BURST CLK CKS CKH CKE t t CMS CMH COMMAND ACTIVE NOP READ t CMS DQM0-DQM3 A0-A9, ROW COLUMN ...

Page 47

IS42S32200B READ - DQM OPERATION CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9 ROW A10 ROW BA0, ...

Page 48

IS42S32200B WRITE - WITHOUT AUTO PRECHARGE CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9 ROW A10 ROW t t DISABLE AUTO ...

Page 49

IS42S32200B WRITE - WITH AUTO PRECHARGE CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND t CMS DQM0-DQM3 A0-A9 ROW ENABLE AUTO PRECHARGE ...

Page 50

IS42S32200B SINGLE WRITE - WITHOUT AUTO PRECHARGE CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9 ROW A10 ROW t t DISABLE ...

Page 51

IS42S32200B SINGLE WRITE - WITH AUTO PRECHARGE CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9 ROW A10 ROW t ...

Page 52

IS42S32200B ALTERNATING BANK WRITE ACCESS CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND t CMS DQM0-DQM3 A0-A9 ROW ENABLE AUTO PRECHARGE A10 ...

Page 53

IS42S32200B WRITE - FULL PAGE BURST CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9 ROW A10 ROW ...

Page 54

IS42S32200B WRITE - DQM OPERATION CLK t t CKS CKH CKE t t CMS CMH ACTIVE NOP COMMAND DQM0-DQM3 A0-A9 ROW A10 ROW BA0, ...

Page 55

IS42S32200B ORDERING INFORMATION Commercial Range Frequency Speed (ns) 166 MHz 6 166 MHz 6 143 MHz 7 143 MHz 7 Industrial Range: - Frequency Speed (ns) 166 MHz 6 166 MHz ...

Page 56

PACKAGING INFORMATION Plastic TSOP 54–Pin, 86-Pin Package Code: T (Type II Plastic TSOP (T - Type II) Millimeters Symbol Min Max Ref. Std. No. Leads ( — 1.20 A1 0.05 0.15 A2 — ...

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