MT47H64M16HR-3 Micron Technology Inc, MT47H64M16HR-3 Datasheet - Page 70

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MT47H64M16HR-3

Manufacturer Part Number
MT47H64M16HR-3
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT47H64M16HR-3

Lead Free Status / RoHS Status
Compliant

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Commands
Truth Tables
Table 36: Truth Table – DDR2 Commands
Notes: 1–3 apply to the entire table
PDF: 09005aef821ae8bf
Rev. O 9/08 EN
Function
LOAD MODE
REFRESH
SELF REFRESH entry
SELF REFRESH exit
Single bank
PRECHARGE
All banks PRECHARGE
Bank ACTIVATE
WRITE
WRITE with auto
precharge
READ
READ with auto
precharge
NO OPERATION
Device DESELECT
Power-down entry
Power-down exit
Notes:
Previous
Cycle
The following tables provide a quick reference of available DDR2 SDRAM commands,
including CKE power-down modes and bank-to-bank commands.
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
1. All DDR2 SDRAM commands are defined by states of CS#, RAS#, CAS#, WE#, and CKE at
2. The state of ODT does not affect the states described in this table. The ODT function is
3. “X” means “H or L” (but a defined logic level) for valid Idd measurements.
4. BA2 is only applicable for densities ≥1Gb.
CKE
the rising edge of the clock.
not available during self refresh. See ODT Timing (page 129) for details.
Current
Cycle
H
H
H
H
H
H
H
H
H
H
X
X
H
L
L
CS#
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
RAS# CAS#
H
H
H
H
H
H
H
H
X
X
X
X
L
L
L
L
L
L
70
X
H
H
H
H
H
X
X
H
X
H
L
L
L
L
L
L
L
Micron Technology, Inc. reserves the right to change products or specifications without notice.
WE#
H
H
H
H
H
H
H
H
H
X
X
X
X
L
L
L
L
L
1Gb: x4, x8, x16 DDR2 SDRAM
BA2–
BA0
BA
BA
BA
BA
BA
BA
BA
X
X
X
X
X
X
X
X
Column
Column
Column
Column
address
address
address
address
An–
A11
X
X
X
X
X
X
X
X
X
© 2004 Micron Technology, Inc. All rights reserved.
Row address
OP code
A10
X
X
X
H
H
H
X
X
X
X
L
L
L
Column
Column
Column
Column
address
address
address
address
Commands
A9–A0 Notes
X
X
X
X
X
X
X
X
X
4, 5,
4, 5,
4, 5,
4, 5,
4, 6
4, 7
6, 8
6, 8
6, 8
6, 8
6
4
9
9

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