EMIF06-MSD02N16 STMicroelectronics, EMIF06-MSD02N16 Datasheet - Page 9
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EMIF06-MSD02N16
Manufacturer Part Number
EMIF06-MSD02N16
Description
IC EMI FILTER ESD 16-MICRO QFN
Manufacturer
STMicroelectronics
Series
IPAD™r
Datasheet
1.EMIF06-MSD02N16.pdf
(12 pages)
Specifications of EMIF06-MSD02N16
Filter Type
Signal Line
Mounting Type
Surface Mount
Termination Style
Surface Mount (SMD,SMT)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Inductance
-
Other names
497-8751-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EMIF06-MSD02N16
Manufacturer:
TPC
Quantity:
1
EMIF06-MSD02N16
5
5.1
Recommendation on PCB assembly
Stencil opening design
1.
Figure 16. Stencil opening dimensions
2.
Figure 17. Recommended stencil window position
General recommendation on stencil opening design
a)
b)
Reference design
a)
b)
c)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
General design rule
Stencil thickness (T) = 75 ~ 125 µm
Stencil opening thickness: 100 µm
Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
Stencil opening for leads: Opening to footprint ratio is 90%.
300 µm
Aspect Ratio
Aspect Area
350 µm
5 µm
190 µm
200 µm
=
=
2800 µm
2100 µm
W
---- -
--------------------------- -
2T L
T
5 µm
L
≥
(
×
1.5
+
W
15 µm
15 µm
W
)
L
≥
350 µm
0.66
T
1.6
50 µm
50 µm
W
0.70
Recommendation on PCB assembly
0.40
Footprint
Stencil window
Footprint
3.00
2.30
0.20
0.45
0.30
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