RD38F2020W0YTQ0 Micron Technology Inc, RD38F2020W0YTQ0 Datasheet - Page 11

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RD38F2020W0YTQ0

Manufacturer Part Number
RD38F2020W0YTQ0
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of RD38F2020W0YTQ0

Operating Supply Voltage (max)
1.95V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
RD38F2020W0YTQ0
Manufacturer:
INTEL
Quantity:
6 222
Part Number:
RD38F2020W0YTQ0
Manufacturer:
SEMTECH
Quantity:
1 048
3.0
Figure 1.
Datasheet
Dimensions
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Length
Package Body Width
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along E
Corner to Ball A1 Distance Along D
Package Information
The following packages are offered with the 32WQ and 64WQ Family :
Mechanical Specifications for 1- or 2-Die SCSP Device (8x10x1.2 mm)
Figure 1, “Mechanical Specifications for 1- or 2-Die SCSP Device (8x10x1.2 mm)”
Figure 2, “Mechanical Specifications for Triple-Die SCSP Device (8x10x1.4 mm)”
Mark
B
G
M
A
C
D
E
F
H
J
K
L
A2
1
Intel® Wireless Flash Memory (W18/W30 SCSP)
2
3
Top View - Ball
Order Number: 251407, Revision: 009
4
Down
E
5
6
7
8
Symbol
A1
A2
S1
S2
A
D
N
b
E
Y
e
A1
D
Intel® Wireless Flash Memory (W18/W30 SCSP)
0.200
0.325
9.900
7.900
1.100
0.500
Min
A
B
C
D
E
G
H
K
M
F
J
L
Millimeters
8
10.000
0.860
0.375
8.000
0.800
1.200
0.600
Nom
88
b
Bottom View - Ball Up
7
6
10.100
5
1.200
0.425
8.100
0.100
1.300
0.700
Max
4
A
Drawing not to scale.
3
Notes
2
1
0.0079
0.0128
0.3898
0.3110
0.0433
0.0197
Min
e
S2
Y
Inches
0.0339
0.0148
0.3937
0.3150
0.0315
0.0472
0.0236
Nom
88
June 2005
0.04
0.01
0.39
0.31
0.00
0.05
0.02
Ma
11

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