TZA3033T/C3,112 NXP Semiconductors, TZA3033T/C3,112 Datasheet - Page 18

• Manufacturer Part Number: TZA3033T/C3,112
• Manufacturer: NXP Semiconductors

Specifications of TZA3033T/C3,112

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Compliant

Philips Semiconductors
BONDING PAD LOCATIONS
Note
1. All coordinates are referenced, in m, to the bottom
2002 Sep 06
DREF
TESTA
GND
GND
IPhoto
TESTB
GND
GND
GND
GND
OUT
OUTQ
V
V
AGC
SYMBOL
CC
CC
SDH/SONET STM1/OC3
transimpedance amplifier
left-hand corner of the die.
PAD
10
11
12
13
14
15
1
2
3
4
5
6
7
8
9
COORDINATES
215
360
549
691
785
785
567
424
259
95
95
95
95
95
95
x
1055
1055
1055
881
735
618
473
285
147
501
641
95
95
95
95
y
(1)
18
1300
Fig.21 Bonding pad locations of the TZA3033U.
m
TESTA
TESTB
IPhoto
DREF
x
GND
GND
0
y
0
1
2
3
4
5
6
7
15
TZA3033U
8
1030 m
14
9
13
Product specification
10
TZA3033
12
11
MGT563
OUTQ
OUT