TDA6107AJF/N1,112 NXP Semiconductors, TDA6107AJF/N1,112 Datasheet

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TDA6107AJF/N1,112

Manufacturer Part Number
TDA6107AJF/N1,112
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA6107AJF/N1,112

Power Supply Requirement
Single
Mounting
Through Hole
Lead Free Status / RoHS Status
Compliant
1. General description
2. Features
3. Ordering information
Table 1:
Type number
TDA6107AJF
Ordering information
Package
Name
DBS9MPF
The TDA6107AJF contains three video output amplifiers which are intended to drive the
three cathodes of a color CRT. The device is contained in a plastic DIL-bent-SIL 9-pin
medium power (DBS9MPF) package, and uses high-voltage DMOS technology.
To obtain maximum performance, the amplifier should be used with black-current control.
TDA6107AJF
Triple video output amplifier
Rev. 02 — 28 April 2005
Typical bandwidth of 5.5 MHz for an output signal of 60 V (p-p)
High slew rate of 900 V/ s
No external components required
Very simple application
Single supply voltage of 200 V
Internal reference voltage of 2.5 V
Fixed gain of 81
Black-Current Stabilization (BCS) circuit with voltage window from 1.8 V to 6 V and
current window from +100 A to 10 mA
Thermal protection
Internal protection against positive flashover discharges appearing on the CRT
Description
plastic DIL-bent-SIL medium power package with fin; 9 leads
Product data sheet
Version
SOT111-1

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TDA6107AJF/N1,112 Summary of contents

Page 1

TDA6107AJF Triple video output amplifier Rev. 02 — 28 April 2005 1. General description The TDA6107AJF contains three video output amplifiers which are intended to drive the three cathodes of a color CRT. The device is contained in a plastic ...

Page 2

Philips Semiconductors 4. Block diagram MIRROR 1 CURRENT SOURCE THERMAL PROTECTION CIRCUIT Fig 1. Block diagram (one amplifier shown) 9397 750 14728 Product data ...

Page 3

Philips Semiconductors 5. Pinning information 5.1 Pinning Fig 2. Pin configuration 5.2 Pin description Table 2: Symbol V i(1) V i(2) V i(3) GND oc(3) V oc(2) V oc(1) 9397 750 14728 Product data sheet ...

Page 4

Philips Semiconductors 6. Internal circuitry esd to black-current measurement circuit 5 esd 6 black-current measurement circuit (1) All pins have an energy protection for positive or negative overstress situations. Fig 3. Internal pin configuration 7. ...

Page 5

Philips Semiconductors 8. Thermal characteristics Table 4: Symbol R th(j-a) R th(j-fin) [1] An external heatsink is necessary; see Application Note AN10227-01 . (1) Infinite heatsink. (2) No heatsink. Fig 4. Power derating curves 8.1 Thermal protection The internal thermal ...

Page 6

Philips Semiconductors 9. Characteristics Table 5: Characteristics Operating range +150 oc(1) oc(2) oc( test circuit of Figure 9; unless ...

Page 7

Philips Semiconductors Table 5: Characteristics …continued Operating range +150 oc(1) oc(2) oc( test circuit of Figure 9; unless otherwise ...

Page 8

Philips Semiconductors 2. (V) 2.34 1.73 150 140 V oc (V) 100 60 50 Fig 7. Output voltage [pins V oc(1) 9397 750 14728 Product data sheet ( oc(r) t co(p) , ...

Page 9

Philips Semiconductors Fig 8. Output voltage [pins V 10. Application information 10.1 Cathode output The cathode output is protected against peak currents (caused by positive voltage peaks during high-resistance flash maximum with a charge content of 100 ...

Page 10

Philips Semiconductors To limit the diode current an external 1.5 k carbon high-voltage resistor in series with the cathode output and spark gap are needed (for this resistor value, the CRT has to be connected to the ...

Page 11

Philips Semiconductors 11. Test information Current sources J1, J2 and J3 must be adjusted so that the DC output ...

Page 12

Philips Semiconductors 12. Package outline DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads P pin 1 index DIMENSIONS (mm are the original dimensions UNIT max. 18.5 ...

Page 13

Philips Semiconductors 13. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However completely safe desirable to take normal precautions appropriate to handling integrated circuits. 14. Soldering 14.1 Introduction to soldering through-hole ...

Page 14

Philips Semiconductors 15. Revision history Table 7: Revision history Document ID Release date TDA6107AJF_2 20050428 • Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • Changed ...

Page 15

Philips Semiconductors 16. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 16

Philips Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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