NFL21SP706X1C3D Murata Electronics North America, NFL21SP706X1C3D Datasheet - Page 94

• Manufacturer Part Number: NFL21SP706X1C3D
• Description: FILTER LC HIGH FREQ 76PF 0805
• Manufacturer: Murata Electronics North America
• Series: EMIFIL®, NFL21SPr

Specifications of NFL21SP706X1C3D

• Center / Cutoff Frequency: 70MHz
• Voltage: 16V
• Current: 150mA
• Capacitance: 76pF
• Filter Type: Low Pass
• Package / Case: 0805 (2012 Metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Impedance: -
• Attenuation Value: -
• Other names: 490-2541-2; NFM2012K04F706T1

BLp Chip Ferrite Bead
o
!Note
92
BLM
BLA
2. Solder Paste Printing and Adhesive Application
(Except BLM
15_AN1 series)
PCB Warping
When reflow soldering the chip ferrite beads, the printing
must be conducted in accordance with the following
cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
oEnsure that solder is applied smoothly to a
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
minimum height of 0.2mm to 0.3mm at the end
surface of the part.
50-80 m: BLM02
100-150 m: BLM03
100-200 m: BLM15/18/21/31/41
100-150 m: BLA2A
150-200 m: BLA31
0.8
Soldering and Mounting
0.4
BLA31
Solder Paste Printing
0.25
1.75
BLA2A
0.25
When flow soldering the chip ferrite beads, apply the
adhesive in accordance with the following conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Poor example
PCB
PCB
BLM18/21/31/41 Series
(Except BLM18G Series)
Coating amount is illustrated in the
following diagram.
BLA31 Series
Coating amount is illustrated in the
following diagram.
Adhesive Application
Chip Solid Inductor
Chip Solid Inductor
Land
Land
Bonding agent
Bonding Agent
Good example
b
a
a: 20 70 m
b: 30 35 m
c: 50 105 m
a: 20 70 m
b: 30 35 m
c: 50 105 m
a
a
b
b
(in mm)
c
c
Mar.28,2011
C31E.pdf