NFL21SP706X1C3D Murata Electronics North America, NFL21SP706X1C3D Datasheet - Page 200

• Manufacturer Part Number: NFL21SP706X1C3D
• Description: FILTER LC HIGH FREQ 76PF 0805
• Manufacturer: Murata Electronics North America
• Series: EMIFIL®, NFL21SPr

Specifications of NFL21SP706X1C3D

• Center / Cutoff Frequency: 70MHz
• Voltage: 16V
• Current: 150mA
• Capacitance: 76pF
• Filter Type: Low Pass
• Package / Case: 0805 (2012 Metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Impedance: -
• Attenuation Value: -
• Other names: 490-2541-2; NFM2012K04F706T1

BNX Block Type EMIFILr SMD Type
(2) Soldering Profile
(3) Reworking with Solder Iron
(1) Soldering Methods
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
!Note
198
4. Cleaning
3. Standard Soldering Conditions
oReflow Soldering Profile
Use reflow soldering methods only.
Use standard soldering conditions when soldering
type EMIFILr SMD
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150 C 60s min.
Soldering iron power output: 100W max.
Temperature of soldering iron tip / Soldering time / Times:
Do not clean BNX022/023/024/025 series. In case of cleaning, please contact Murata engineering.
(Sn-3.0Ag-0.5Cu solder)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
450 C max. / 5s max. / 1 time
BNX022/023/024/025
solder will deteriorate performance of products.
Series
type.
220 C min.
Temp. (T1)
Soldering and Mounting
180
150
Heating
30 to 60s
Time. (t1)
Standard Profile
Pre-heating
90s 30s
block
Temperature
T2
T1
250 3 C
Peak
(T2)
t1
t2
Flux:
o Use Rosin-based flux.
o Do not use strong acidic flux (with chlorine content
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
of Reflow
Time (s)
2 times
cleaned completely with no residual flux.
exceeding 0.20wt%)
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
T4
T3
Cycle
In case of using RA type solder, products should be
max.
Limit Profile
Standard Profile
230 C min.
Temp. (T3)
Heating
60s max.
Time. (t2)
Limit Profile
Temperature
260 C/10s
Peak
(T4)
of Reflow
2 times
Cycle
max.
Mar.28,2011
C31E.pdf