SST39VF1602-70-4C-B3KE-T Microchip Technology, SST39VF1602-70-4C-B3KE-T Datasheet - Page 30

• Manufacturer Part Number: SST39VF1602-70-4C-B3KE-T
• Description: 2.7V To 3.6V 16Mbit Multi-Purpose Flash 48 TFBGA 6x8x1.2 Mm T/R
• Manufacturer: Microchip Technology

Specifications of SST39VF1602-70-4C-B3KE-T

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (1M x 16)
• Speed: 70ns
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 48-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Data Sheet
PACKAGING DIAGRAMS
©2008 Silicon Storage Technology, Inc.
Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions,
FIGURE 25: 48-lead Thin Small Outline Package (TSOP) 12mm x 20mm
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
although some dimensions may be more stringent.
0.70
0.50
SST Package Code: EK
Pin # 1 Identifier
18.50
18.30
20.20
19.80
16 Mbit / 32 Mbit Multi-Purpose Flash Plus
30
12.20
11.80
SST39VF1601 / SST39VF3201
SST39VF1602 / SST39VF3202
1.20
max.
DETAIL
1mm
1.05
0.95
S71223-05-000
48-tsop-EK-8
0.15
0.05
0.70
0.50
BSC
0.50
0.27
0.17
0°- 5°
6/08