S29JL032J70TFI420 Spansion Inc., S29JL032J70TFI420 Datasheet - Page 14

• Manufacturer Part Number: S29JL032J70TFI420
• Description: IC 3V 32M SIMULTANEOUS READ/WRITE FLASH
• Manufacturer: Spansion Inc.

Specifications of S29JL032J70TFI420

• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 70ns
• Interface Type: Serial
• Boot Type: Bottom
• Address Bus: 22/21Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 4M/2M
• Supply Current: 16mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Supplier Unconfirmed

7.
14
Ordering Information
The order number (Valid Combination) is formed by the following:
Note:
1. Type 0 is standard. Specify others as required.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
Spansion sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Device Number/
S29JL032J
Description
S29JL032J
Device Family
S29JL032J
3.0 Volt-only, 32 Mbit (2 M x 16-Bit/4 M x 8-Bit) Simultaneous Read/Write Flash Memory
Manufactured on 110 nm process technology
60
Speed (ns)
60, 70
T
F
Package Type
I
D a t a
BH
TF
01
0
S29JL032J
S29JL032J Valid Combinations
S h e e t
Temperature
Packing Type
0 = Tray
3 = 13-inch Tape and Reel
Model Number
01 = Top Boot Device, 4 Banks: 4/12/12/4 Mb
02 = Bottom Boot Device, 4 Banks: 4/12/12/4 Mb
21 = Top Boot Device, 2 Banks: 4/28 Mb
22 = Bottom Boot Device, 2 Banks: 4/28 Mb
31 = Top Boot Device, 2 Banks: 8/24 Mb
32 = Bottom Boot Device, 2 Banks: 8/24 Mb
41 = Top Boot Device, 2 Banks: 16/16 Mb
42 = Bottom Boot Device, 2 Banks: 16/16 Mb
Temperature Range
I
Package Material Set
F = Pb-free
H = Low-halogen, Pb-free
Package Type
B = Fine-pitch Ball Grid Array Package
T = Thin Small Outline Package (TSOP) Standard Pinout
Speed Option
60 = 60 ns
70 = 70 ns
Range
= Industrial (–40°C to +85°C)
I
( P r e l i m i n a r y )
01, 02, 21, 22, 31, 32, 41, 42
Ordering Options
Additional
31, 32
S29JL032J_00_03 August 25, 2010
Packing
0, 3
Type
(1)
VBK048
TS048
Description
Package
TSOP
FBGA