S29AS008J70BFI030 Spansion Inc., S29AS008J70BFI030 Datasheet - Page 53

• Manufacturer Part Number: S29AS008J70BFI030
• Description: IC 8M FLASH MEMORY
• Manufacturer: Spansion Inc.

Specifications of S29AS008J70BFI030

• Cell Type: NOR
• Density: 8Mb
• Access Time (max): 70ns
• Interface Type: Parallel
• Boot Type: Bottom/Top
• Address Bus: 20/19Bit
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: FBGA
• Program/erase Volt (typ): 1.65 to 1.95V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.65V
• Operating Supply Voltage (max): 1.95V
• Word Size: 8/16Bit
• Number Of Words: 1M/512K
• Supply Current: 12mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Compliant

21.2
July 16, 2009 S29AS008J_00_08
VBK048—48-Ball Fine-Pitch Ball Grid Array (FBGA) 8.15 mm x 6.15 mm
CORNER
PACKAGE
JEDEC
SYMBOL
A
SD / SE
PIN A1
MD
ME
D1
A1
A2
E1
φb
A
D
E
N
e
A1
MIN
0.18
0.62
0.35
8.15 mm x 6.15 mm NOM
---
INDEX MARK
10
PACKAGE
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
0.80 BSC.
0.40 BSC.
VBK 048
NOM
N/A
---
---
---
48
---
---
8
6
SEATING PLANE
TOP VIEW
SIDE VIEW
D a t a
MAX
1.00
0.76
0.43
---
D
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S h e e t
S29AS008J
NOTE
A
0.10
A2
C
(4X)
E
B
e
0.08
0.10
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
C
6
C
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
φb
φ 0.08
φ 0.15
H
M
M
C
C
G
A
BOTTOM VIEW
B
F
E
D1
D
SD
C
7
B
A
6
5
4
3
2
1
3338 \ 16-038.25b
A1 CORNER
SE
7
E1
53