PIC24HJ16GP304T-I/ML Microchip Technology, PIC24HJ16GP304T-I/ML Datasheet - Page 254
![16-bit MCU, 16KB Flash,40 MIPS,nanoWatt 44 QFN 8x8x0.9mm T/R](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC24HJ16GP304T-I/ML
Manufacturer Part Number
PIC24HJ16GP304T-I/ML
Description
16-bit MCU, 16KB Flash,40 MIPS,nanoWatt 44 QFN 8x8x0.9mm T/R
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ32GP202-ISO.pdf
(272 pages)
3.PIC24HJ32GP202-ISO.pdf
(8 pages)
4.PIC24HJ32GP202-ISO.pdf
(12 pages)
Specifications of PIC24HJ16GP304T-I/ML
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
16KB (5.5K x 24)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 13x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PIC24HJ16GP304T-I/MLTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ16GP304T-I/ML
Manufacturer:
MICROCHIP
Quantity:
12 000
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ32GP202-ISO PDF datasheet #2
- PIC24HJ32GP202-ISO PDF datasheet #3
- PIC24HJ32GP202-ISO PDF datasheet #4
- Current page: 254 of 272
- Download datasheet (4Mb)
PIC24HJ32GP202/204 AND PIC24HJ16GP304
DS70289G-page 254
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
φ
E1
Units
D1
L
A2
A1
L1
E1
N
A
E
D
e
L
φ
c
b
α
β
NOTE 2
E
A1
A
0.95
0.05
0.45
0.09
0.30
MIN
11°
11°
0°
–
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
Microchip Technology Drawing C04-076B
–
–
–
© 2011 Microchip Technology Inc.
α
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
7°
A2
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