PIC18LF14K50T-I/SO Microchip Technology, PIC18LF14K50T-I/SO Datasheet - Page 377

• Manufacturer Part Number: PIC18LF14K50T-I/SO
• Description: 16 KB Flash, 768 RAM, 15 I/O, 10-Bit ADC, USB 2.0, NanoWatt XLP 20 SOIC .300in T
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18LF14K50T-I/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 14
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SOIC (7.5mm Width)
• Processor Series: PIC18LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: EUSART, I2C, MSSP, SPI, USB
• Maximum Clock Frequency: 32 KHz
• Number Of Programmable I/os: 18
• Number Of Timers: 4
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM164127, DV164126
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

27.6
 2010 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1:
Param
No.
2:
3:
Thermal Considerations
P
INTERNAL
T
P
TBD = To Be Determined
I
T
T
Sym
P
DD
JMAX


PD
A
J
DER
JC
I
JA
/
= Ambient Temperature
= Junction Temperature
O
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
 +125°C
Preliminary
108.1
TBD
62.4
85.2
31.4
Typ
150
24
24
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
PIC18F/LF1XK50
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 5x5mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
PD = P
P
P
P
INTERNAL
I
DER
/
O
=  (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) +  (I
- T
DD
I
/
O
A
DS41350E-page 377
(1)
)/
OH
JA
(2)
* (V
DD
- V
OH
))