PIC18LF14K50T-I/SO Microchip Technology, PIC18LF14K50T-I/SO Datasheet - Page 377
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC18LF14K50T-I/SO
Manufacturer Part Number
PIC18LF14K50T-I/SO
Description
16 KB Flash, 768 RAM, 15 I/O, 10-Bit ADC, USB 2.0, NanoWatt XLP 20 SOIC .300in T
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F13K50-ISS.pdf
(420 pages)
2.PIC18F13K50-ISS.pdf
(40 pages)
3.PIC18F13K50-ISS.pdf
(10 pages)
4.PIC18F13K50-ISS.pdf
(2 pages)
Specifications of PIC18LF14K50T-I/SO
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
14
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SOIC (7.5mm Width)
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART, I2C, MSSP, SPI, USB
Maximum Clock Frequency
32 KHz
Number Of Programmable I/os
18
Number Of Timers
4
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM164127, DV164126
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18LF14K50T-I/SO
Manufacturer:
MICROCHIP
Quantity:
12 000
- PIC18F13K50-ISS PDF datasheet
- PIC18F13K50-ISS PDF datasheet #2
- PIC18F13K50-ISS PDF datasheet #3
- PIC18F13K50-ISS PDF datasheet #4
- Current page: 377 of 420
- Download datasheet (4Mb)
27.6
2010 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1:
Param
No.
2:
3:
Thermal Considerations
P
INTERNAL
T
P
TBD = To Be Determined
I
T
T
Sym
P
DD
JMAX
PD
A
J
DER
JC
I
JA
/
= Ambient Temperature
= Junction Temperature
O
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
+125°C
Preliminary
108.1
TBD
62.4
85.2
31.4
Typ
150
24
24
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
PIC18F/LF1XK50
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 5x5mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
PD = P
P
P
P
INTERNAL
I
DER
/
O
= (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + (I
- T
DD
I
/
O
A
DS41350E-page 377
(1)
)/
OH
JA
(2)
* (V
DD
- V
OH
))
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