PIC18F45K80-E/ML Microchip Technology, PIC18F45K80-E/ML Datasheet - Page 50
![ECAN, 32KB Flash, 4KB RAM, 16 MIPS, 12-bit ADC, CTMU 44 QFN 8x8x0.9mm TUBE](/photos/39/70/397090/qfn-44_sml.jpg)
PIC18F45K80-E/ML
Manufacturer Part Number
PIC18F45K80-E/ML
Description
ECAN, 32KB Flash, 4KB RAM, 16 MIPS, 12-bit ADC, CTMU 44 QFN 8x8x0.9mm TUBE
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheet
1.PIC18F25K80-ISO.pdf
(628 pages)
Specifications of PIC18F45K80-E/ML
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
ECAN, I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.6K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
*
Processor Series
PIC18F45K80
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
35
Number Of Timers
5
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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PIC18F66K80 FAMILY
TABLE 2-1
2.6
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
Section 3.0 “Oscillator Configurations”
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator cir-
cuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
DS39977C-page 50
Panasonic
Panasonic
Murata
Murata
Make
TDK
TDK
External Oscillator Pins
secondary
SUITABLE CAPACITOR EQUIVALENTS
GRM32DR71C106KA01L
GRM31CR61C106KC31L
C3216X7R1C106K
C3216X5R1C106K
ECJ-3YX1C106K
ECJ-4YB1C106K
Part #
oscillator
for details).
(refer
Capacitance
Preliminary
Nominal
to
10 µF
10 µF
10 µF
10 µF
10 µF
10 µF
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a two-sided
board, avoid any traces on the other side of the board
where the crystal is placed.
Layout suggestions are shown in Figure 2-4. In-line
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to com-
pletely surround the pins and components. A suitable
solution is to tie the broken guard sections to a mirrored
ground layer. In all cases, the guard trace(s) must be
returned to ground.
Base Tolerance Rated Voltage Temp. Range
±10%
±10%
±10%
±10%
±10%
±10%
2011 Microchip Technology Inc.
16V
16V
16V
16V
16V
16V
-55 to 125ºC
-55 to 125ºC
-55 to 125ºC
-55 to 85ºC
-55 to 85ºC
-55 to 85ºC
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