PIC16F1947-E/MR Microchip Technology, PIC16F1947-E/MR Datasheet - Page 232
PIC16F1947-E/MR
Manufacturer Part Number
PIC16F1947-E/MR
Description
28KB Flash, 1KB RAM, 256B EEPROM, LCD, 1.8-5.5V 64 QFN 9x9x0.9mm TUBE
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC16LF1933-ISS.pdf
(46 pages)
3.PIC16LF1946-IPT.pdf
(448 pages)
4.PIC16LF1946-IPT.pdf
(6 pages)
5.PIC16F1946-IPT.pdf
(8 pages)
Specifications of PIC16F1947-E/MR
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
28KB (16K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 17x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-VQFN Exposed Pad, 64-HVQFN, 64-SQFN, 64-DHVQFN
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
MI2C, SPI, EUSART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
54
Number Of Timers
5
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 17 Channel
On-chip Dac
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F722-ISS PDF datasheet
- PIC16LF1933-ISS PDF datasheet #2
- PIC16LF1946-IPT PDF datasheet #3
- PIC16LF1946-IPT PDF datasheet #4
- PIC16F1946-IPT PDF datasheet #5
- Current page: 232 of 448
- Download datasheet (4Mb)
PIC16F/LF1946/47
23.4.5
In Half-Bridge applications where all power switches
are modulated at the PWM frequency, the power
switches normally require more time to turn off than to
turn on. If both the upper and lower power switches are
switched at the same time (one turned on, and the
other turned off), both switches may be on for a short
period of time until one switch completely turns off.
During this brief interval, a very high current
(shoot-through current) will flow through both power
switches, shorting the bridge supply. To avoid this
potentially destructive shoot-through current from
flowing during switching, turning on either of the power
switches is normally delayed to allow the other switch
to completely turn off.
In Half-Bridge mode, a digitally programmable
dead-band delay is available to avoid shoot-through
current from destroying the bridge power switches. The
delay occurs at the signal transition from the non-active
state to the active state. See
illustration. The lower seven bits of the associated
PWMxCON register
period in terms of microcontroller instruction cycles
(T
FIGURE 23-17:
DS41414B-page 232
CY
Standard Half-Bridge Circuit (“Push-Pull”)
or 4 T
OSC
PROGRAMMABLE DEAD-BAND
DELAY MODE
).
(Register
EXAMPLE OF HALF-BRIDGE APPLICATIONS
23-5) sets the delay
Figure 23-16
PxA
PxB
Preliminary
for
FET
Driver
FET
Driver
FIGURE 23-16:
PxA
PxB
td = Dead-Band Delay
Note 1: At this time, the TMRx register is equal to the
(2)
(2)
V+
V-
(1)
2: Output signals are shown as active-high.
td
Pulse Width
PRx register.
Load
Period
td
EXAMPLE OF
HALF-BRIDGE PWM
OUTPUT
2010 Microchip Technology Inc.
+
V
-
+
V
-
(1)
Period
(1)
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