MICRF505YML TR Micrel Inc, MICRF505YML TR Datasheet - Page 5

• Manufacturer Part Number: MICRF505YML TR
• Description: 868-915 MHz ISM Band Transceiver( )
• Manufacturer: Micrel Inc

Specifications of MICRF505YML TR

• Frequency: 850MHz ~ 950MHz
• Data Rate - Maximum: 200kbps
• Modulation Or Protocol: FSK
• Applications: Telemetry, Wireless Controller
• Power - Output: 10dBm
• Sensitivity: -111dBm
• Voltage - Supply: 2.3 V ~ 5.5 V
• Current - Receiving: 13.5mA
• Current - Transmitting: 28mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-MLF®, QFN
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Modulation Type: FSK
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 576-1659-2; MICRF505YMLTR

6.0 RELIABILITY TEST
6.1 REFLOW PROFILE
The Power Of Linking Together
No.
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ABRACON
CORPORATION
Temperature Cycling:
Gross Leak Test:
Fine Leak Test:
Thermal Shock:
Solderability:
Test Items
(ABLS only)
Lead Bend:
Drop Test:
Vibration:
Humidity:
Drawing No. :
The component shall remain within the electrical specification (± 5 pp
max) after 3 cycles of high and low temperature testing (-40°C to
+85°C) for 2 hours max.
The component shall remain within the electrical specification after
exposure at extreme temperature -40°C to +85°C for 5 minutes for 3
cycles.
The component shall remain within the electrical specification after
loaded vibration at 10Hz to 55Hz, amplitude 1.5mm, within 1 minute
for 2 hours minimum on each axis (X,Y,Z).
The component shall remain within the electrical specifications after a
natural drop (3X) on a hard wooden board at 75 cm.
The component shall remain within the electrical specifications after
being kept at a condition of ambient temperature +85°C, 85% RH for
96 hours minimum.
Expose samples to 60PSIG Helium gas for 2 hours.
Max leak rate 2X10-8atmcc/s.
Submerge samples in 100% De-ionized water or Perfluorocarbon at
85°C for at least 1 minute. Check for bubbles.
Solderability of terminals shall be kept at more than 95% after dipped
in solder flux at 260°C ± 5°C for 5 seconds.
The component shall withstand maximum bend of 90°C
reference to base for 2 bends. Solder tinning must be
4 microns thick minimum.
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Test Conditions
Rev. -
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