BKP1608HS181-T Taiyo Yuden, BKP1608HS181-T Datasheet - Page 37
![FERRITE BEAD 180 OHM 0603](/photos/6/6/60696/bkp1608hs181-t_sml.jpg)
BKP1608HS181-T
Manufacturer Part Number
BKP1608HS181-T
Description
FERRITE BEAD 180 OHM 0603
Manufacturer
Taiyo Yuden
Series
BKr
Datasheets
1.BKP1005HM121-T.pdf
(19 pages)
2.BKP1608HS181-T.pdf
(53 pages)
3.BKP1608HS181-T.pdf
(1 pages)
Specifications of BKP1608HS181-T
Impedance @ Frequency
180 Ohm @ 100MHz
Current Rating
1.5A
Dc Resistance (dcr)
75.00 mOhm Max
Filter Type
Differential Mode - Single
Number Of Lines
1
Package / Case
0603 (1608 Metric)
Mounting Type
Surface Mount
Impedance
180ohm
Ferrite Grade
HS
Dc Resistance Max
0.075ohm
Dc Current Rating
1.5A
Ferrite Case Style
0603
No. Of Pins
2
Resistance
0.075ohm
Rohs Compliant
Yes
Ferrite Mounting
SMD
Leaded Process Compatible
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
587-1924-2
BKP1608HS181-T
BKP1608HS181-T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BKP1608HS181-T
Manufacturer:
Taiyo Yuden
Quantity:
24 987
Company:
Part Number:
BKP1608HS181-T
Manufacturer:
TAIYO YUDEN
Quantity:
64 000
Part Number:
BKP1608HS181-T
Manufacturer:
TAIYO/太诱
Quantity:
20 000
Part Number:
BKP1608HS181-TV
Manufacturer:
TAIYO/太诱
Quantity:
20 000
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
3.Considerations for
4.Soldering
automatic placement
PRECAUTIONS
Stages
(1) Flux used should be with less than or equal to 0.1
(2) When soldering inductors on the board, the amount
(3) When using water-soluble flux, special care should be
◆Selection of Flux
1. Since flux may have a significant effect on the perfor-
◆Soldering
Temperature, time, amount of solder, etc. are specified in
accordance with the following recommended conditions.
mance of inductors, it is necessary to verify the follow-
ing conditions prior to use;
wt% (Chlorine conversion method) of halogenated
content. Flux having a strong acidity content should
not be applied.
of flux applied should be controlled at the optimum
level.
taken to properly clean the boards.
Precaution
[Recommended conditions]
1-1. When too much halogenated substance (Chlorine, etc.) content is used
1-2. Flux is used to increase solderability in flow soldering, but if too much is
1-3. Since the residue of water-soluble flux is easily dissolved by water content
1-1. Preheating when soldering
When using adhesives to mount inductors on a PCB, inappropriate amounts of
adhesive on the board may adversely affect component placement. Too little
adhesive may cause the inductors to fall off the board during the solder process.
Too much adhesive may cause defective soldering due excessive flow of adhe-
sive on to the land or solder pad.
in the air, the residue on the surface of Inductor in high humidity conditions
may cause a degradation of insulation resistance and therefore affect the
reliability of the components. The cleaning methods and the capability of the
machines used should also be considered carefully when selecting water-
soluble flux.
to activate the flux, or highly acidic flux is used, an excessive amount of
residue after soldering may lead to corrosion of the terminal electrodes or
degradation of insulation resistance on the surface of the Inductor.
applied, a large amount of flux gas may be emitted and may detrimentally
affect solderability. To minimize the amount of flux applied, it is recom-
mended to use a flux-bubbling system.
Heating: Chip inductor components should be preheated to within 100 to
130℃ of the soldering. Cooling: The temperature difference between the
components and cleaning process should not be greater than 100 ℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or
concentrated heating or rapid cooling.
must be conducted with a great care so as to prevent malfunction of the
components due to excessive thermal shock.
8
Figure
a
b
c
Technical considerations
0805 case sizes as examples
Area with no adhesive
100 ∼120 μm
0.3mm min
Therefore, the soldering process
4/7
255
5