BKP1608HS181-T Taiyo Yuden, BKP1608HS181-T Datasheet - Page 36
![FERRITE BEAD 180 OHM 0603](/photos/6/6/60696/bkp1608hs181-t_sml.jpg)
BKP1608HS181-T
Manufacturer Part Number
BKP1608HS181-T
Description
FERRITE BEAD 180 OHM 0603
Manufacturer
Taiyo Yuden
Series
BKr
Datasheets
1.BKP1005HM121-T.pdf
(19 pages)
2.BKP1608HS181-T.pdf
(53 pages)
3.BKP1608HS181-T.pdf
(1 pages)
Specifications of BKP1608HS181-T
Impedance @ Frequency
180 Ohm @ 100MHz
Current Rating
1.5A
Dc Resistance (dcr)
75.00 mOhm Max
Filter Type
Differential Mode - Single
Number Of Lines
1
Package / Case
0603 (1608 Metric)
Mounting Type
Surface Mount
Impedance
180ohm
Ferrite Grade
HS
Dc Resistance Max
0.075ohm
Dc Current Rating
1.5A
Ferrite Case Style
0603
No. Of Pins
2
Resistance
0.075ohm
Rohs Compliant
Yes
Ferrite Mounting
SMD
Leaded Process Compatible
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
587-1924-2
BKP1608HS181-T
BKP1608HS181-T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BKP1608HS181-T
Manufacturer:
Taiyo Yuden
Quantity:
24 987
Company:
Part Number:
BKP1608HS181-T
Manufacturer:
TAIYO YUDEN
Quantity:
64 000
Part Number:
BKP1608HS181-T
Manufacturer:
TAIYO/太诱
Quantity:
20 000
Part Number:
BKP1608HS181-TV
Manufacturer:
TAIYO/太诱
Quantity:
20 000
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
3.Considerations for
automatic placement
PRECAUTIONS
Stages
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on
2. The maintenance and inspection of the mounter
◆Selection of Adhesives
1. Mounting inductors with adhesives in preliminary
the inductors when mounting onto the PC boards.
should be conducted periodically.
assembly, before the soldering stage, may lead
to degraded inductor characteristics unless the
following factors are appropriately checked; the
size of land patterns, type of adhesive, amount
applied, hardening temperature and hardening
period. Therefore, it is imperative to consult the
manufacturer of the adhesives on proper usage
and amounts of adhesive to use.
Precautions
(1) The lower limit of the pick-up nozzle should be adjusted to the surface level of
(2) The pick-up pressure should be adjusted between 1 and 3 N static loads.
(3) To reduce the amount of deflection of the board caused by impact of the
(1) Required adhesive characteristics
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed
2. As the alignment pin wears out, adjustment of the nozzle height can
1. Some adhesives may cause reduced insulation resistance. The differ-
a. The adhesive should be strong enough to hold parts on the board during
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
Single-sided mounting
Double-sided
on the inductors, causing damage. To avoid this, the following points should
be considered before lowering the pick-up nozzle:
cause chipping or cracking of the inductors because of mechanical im-
pact on the inductors. To avoid this, the monitoring of the width between
the alignment pin in the stopped position, and maintenance, inspection
and replacement of the pin should be conducted periodically.
ence between the shrinkage percentage of the adhesive and that of the
inductors may result in stresses on the inductors and lead to cracking.
Moreover, too little or too much adhesive applied to the board may ad-
versely affect component placement, so the following precautions should
be noted in the application of adhesives.
the PC board after correcting for deflection of the board.
pick-up nozzle, supporting pins or back-up pins should be used under the PC
board. The following diagrams show some typical examples of good pick-up
nozzle placement:
mounting
the mounting & solder process.
8
Improper method
Technical considerations
Proper method
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