HC55185ECM Intersil, HC55185ECM Datasheet - Page 19

• Manufacturer Part Number: HC55185ECM
• Manufacturer: Intersil

Specifications of HC55185ECM

• Number Of Channels: 1
• On-hook Transmission: Yes
• Polarity Reversal: Yes
• On-chip Ring Relay Driver: Yes
• Longitudinal Balanced: 64
• Operating Supply Voltage (typ): 5/-18/-24/-28V
• Operating Temp Range: 0C to 85C
• Package Type: PLCC
• Loop Current Limit: 45mA
• Operating Temperature Classification: Commercial
• Pin Count: 28
• Mounting: Surface Mount
• Operating Current: 10.3mA
• Operating Supply Voltage (max): 5.25/-52V
• Operating Supply Voltage (min): 4.75/-16V
• Lead Free Status / RoHS Status: Not Compliant

(DATUM A)
SEATING PLANE
Quad Flat No-Lead Plastic Package (QFN)
FOR ODD TERMINAL/SIDE
2X
INDEX
AREA
2X
C
(DATUM B)
INDEX
AREA
AREA
6
0.15
6
0.15
C
4X P
4X
NX L
4X P
e
C
C
8
A
C
C L
0
1
2
3
B
A
9
N
BOTTOM VIEW
N
SIDE VIEW
TOP VIEW
NX b
e
(Nd-1)Xe
REF.
D2
D1
5
D
D2
NX b
L1
2
TERMINAL TIP
D1/2
SECTION "C-C"
D/2
5
N
10
0.10
L
7
19
NX k
1
2
3
2X
A3
E2/2
M C
8
0.15
A2
E1/2
9
CORNER
OPTION 4X
E2
A1
FOR EVEN TERMINAL/SIDE
A1
A
C
E1
A
B
7
8
A
(Ne-1)Xe
9
C L
E/2
/ /
REF.
9
0.08
0.10 C
E
B
e
2X
C
L1
0.15
10
C
L
B
HC55185
L32.7x7
32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VKKC ISSUE C)
NOTES:
10. Depending on the method of lead termination at the edge of the
SYMBOL
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
6. The configuration of the pin #1 identifier is optional, but must be
7. Dimensions D2 and E2 are for the exposed pads which provide
8. Nominal dimensions are provided to assist with PCB Land
9. Features and dimensions A2, A3, D1, E1, P & θ are present
A1
A2
A3
D1
D2
E1
E2
Nd
Ne
between 0.15mm and 0.30mm from the terminal tip.
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
improved electrical and thermal performance.
Pattern Design efforts, see Intersil Technical Brief TB389.
when Anvil singulation method is used and not present for saw
singulation.
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.
L1
A
D
E
N
P
b
e
k
L
θ
0.23
4.55
4.55
0.25
0.50
0.80
MIN
-
-
-
-
-
MILLIMETERS
0.20 REF
7.00 BSC
6.75 BSC
7.00 BSC
6.75 BSC
0.65 BSC
0.28
4.70
4.70
0.60
TYP
0.90
32
8
8
-
-
-
-
-
-
1.00
0.05
1.00
0.38
4.85
4.85
0.75
0.15
0.60
MAX
12
-
December 18, 2006
Rev. 4 8/03
NOTES
5, 8
7, 8
7, 8
FN4831.14
10
9
9
9
9
8
2
3
3
9
9
-
-
-
-
-
-