LAN8187-JT Standard Microsystems (SMSC), LAN8187-JT Datasheet - Page 75

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LAN8187-JT

Manufacturer Part Number
LAN8187-JT
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet

Specifications of LAN8187-JT

Number Of Receivers
1
Data Rate
10/100Mbps
Operating Supply Voltage (typ)
3.3V
Package Type
TQFP
Operating Temperature Classification
Commercial
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Mounting
Surface Mount
Pin Count
64
Operating Temperature (max)
70C
Operating Temperature (min)
0C
Lead Free Status / RoHS Status
Compliant

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±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX & flexPWR
Datasheet
Chapter 9 Package Outline
SMSC LAN8187/LAN8187i
ccc
A1
A2
E1
R2
L1
D1
W
A
D
E
H
R
L
e
θ
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Figure 9.1 64 Pin TQFP Package Outline, 10X10X1.4 Body, 12x12 mm Footprint
11.80
11.80
0.05
1.35
9.80
9.80
0.09
0.45
0.17
0.08
0.08
MIN
0
~
~
~
Maximum mold protrusion is 0.25 mm per side.
o
0.50 Basic
NOMINAL
0.60
1.00
0.22
~
~
~
~
~
~
~
~
~
~
~
~
Table 9.1 64 Pin TQFP Package Parameters
12.20
10.20
12.20
10.20
MAX
1.60
0.15
1.45
0.20
0.75
0.27
0.20
0.08
DATASHEET
7
~
~
o
75
®
Technology
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Radius
Lead Foot Length
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
REMARKS
Lead Width
Coplanarity
Lead Pitch
Standoff
X Span
Y Span
Revision 1.6 (02-27-09)

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