ISP1102AW,115 NXP Semiconductors, ISP1102AW,115 Datasheet - Page 17

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ISP1102AW,115

Manufacturer Part Number
ISP1102AW,115
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of ISP1102AW,115

Number Of Transmitters
1
Number Of Receivers
1
Power Supply Requirement
Quad
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Dual Supply Voltage (max)
3.6/5.5V
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
14. Package outline
Fig 11. Package outline SOT639-2 (HBCC16)
ISP1102A_1
Product data sheet
HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT639-2
max.
0.8
A
0.10
0.05
terminal 1
index area
A
e 4
1
1/2 e 4
0.7
0.6
A
2
5
1
0.33
0.27
b
IEC
0.33
0.27
1/2 e 3
b 1
16
0.38
0.32
b 2
e 1
D h
e 3
D
e
0.38
0.32
MO-217
0
b 3
JEDEC
3.1
2.9
REFERENCES
D
Rev. 01 — 15 February 2007
13
1.45
1.35
9
D h
X
B
e
E h
E
A
3.1
2.9
E
JEITA
e 2
scale
2.5
1.45
1.35
E h
0.5
e
2.5
e 1
y 1 C
2.5
e 2
detail X
5 mm
2.45
f
e 3
A 2
b 2
A
b
2.45
PROJECTION
e 4
EUROPEAN
Advanced USB transceiver
A 1
C
0.23
0.17
b 1
w
w
v
v
f
y
b 3
M
M
M
M
0.08
C
C
C
C
v
w
v
ISP1102A
A
A
M
M
w
v
© NXP B.V. 2007. All rights reserved.
B
B
0.1
C
C
M
M
w
ISSUE DATE
A
C
C
01-11-13
03-03-12
0.05
B
A
SOT639-2
y
B
0.2
y 1
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